EP 1193391 A1 20020403 - Coil system including a structure for preventing fluid from leaking therein
Title (en)
Coil system including a structure for preventing fluid from leaking therein
Title (de)
Spulensystem mit einer Struktur zum Verhindern von Fluidleckage
Title (fr)
Système de bobine avec une structure pour empêcher les fuites de fluide
Publication
Application
Priority
JP 2000295892 A 20000928
Abstract (en)
A coil system (50) includes a bobbin (51, 81), a coil (52, 82) wrapped around the bobbin, terminal members (53, 83), a resin coating member (54, 84), a stator (55), a housing (56), and a connector (58). The resin coating member covers the bobbin, the coil and the terminal members so as to seal up them. Further, the resin coating member insulates the coil and the terminal members from the stator and the housing. O-rings (59) are disposed circumferentially on the external surface of the resin coating member so as to prevent fluid from leaking into the coil system. Further, weld portions (541, 542, 91) are formed on the resin coating member, and welded to a connector cap (581) of the connector. Thereby fluid leaking into the coil system from the boundary portion (A) of the resin coating member and the connector cap is blocked. <IMAGE>
IPC 1-7
IPC 8 full level
F02M 47/02 (2006.01); F02M 51/00 (2006.01); F02M 51/06 (2006.01); F02M 51/08 (2006.01); F02M 59/46 (2006.01); H01F 5/06 (2006.01); H01F 7/06 (2006.01); H01F 7/16 (2006.01)
CPC (source: EP)
F02M 47/027 (2013.01); F02M 51/005 (2013.01); F02M 63/0017 (2013.01); H01F 5/06 (2013.01); F02M 2200/16 (2013.01)
Citation (search report)
- [YA] US 5967419 A 19991019 - YAMAGUCHI TAKAO [JP], et al
- [A] DE 19756604 A1 19990701 - SIEMENS AG [DE]
- [A] DE 2618163 A1 19771117 - HISS ECKART
- [XY] PATENT ABSTRACTS OF JAPAN vol. 1995, no. 01 28 February 1995 (1995-02-28)
- [A] PATENT ABSTRACTS OF JAPAN vol. 017, no. 407 (M - 1454) 29 July 1993 (1993-07-29)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1193391 A1 20020403; EP 1193391 B1 20060329; DE 60118285 D1 20060518; DE 60118285 T2 20061109; JP 2002110419 A 20020412; JP 3669425 B2 20050706
DOCDB simple family (application)
EP 01123048 A 20010926; DE 60118285 T 20010926; JP 2000295892 A 20000928