EP 1196349 A1 20020417 - MICRO-ELECTROMECHANICAL DEVICES AND METHODS OF MANUFACTURE
Title (en)
MICRO-ELECTROMECHANICAL DEVICES AND METHODS OF MANUFACTURE
Title (de)
MIKROELEKTROMECHANISCHE BAUELEMENTE UND VERFAHREN ZU DEREN HERSTELLUNG
Title (fr)
DISPOSITIFS MICROELECTRIQUES ET LEURS PROCEDES DE FABRICATION
Publication
Application
Priority
- US 0017988 W 20000629
- US 14141399 P 19990629
Abstract (en)
[origin: WO0100523A1] Micro-electromechanical devices, substrate assemblies from which the devices can be manufactured, and methods to manufacture the devices are disclosed. The invention combines the advantages of conventional surface and bulk micromachining processes using a sacrificial layer to create an integrated micro-electromechanical system (MEMS) technology that provides high performance, high yield, and manufacturing tolerance. The devices manufactured according to the present invention include, but are not limited to, pressure sensors, vibration sensors, accelerometers, gas or liquid pumps, flow sensor, resonant devices, and infrared detectors.
IPC 1-7
IPC 8 full level
B81B 3/00 (2006.01)
CPC (source: EP)
B81C 1/00182 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/0109 (2013.01)
Citation (search report)
See references of WO 0100523A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT
DOCDB simple family (publication)
WO 0100523 A1 20010104; WO 0100523 A9 20020725; AU 5901100 A 20010131; CA 2377189 A1 20010104; EP 1196349 A1 20020417
DOCDB simple family (application)
US 0017988 W 20000629; AU 5901100 A 20000629; CA 2377189 A 20000629; EP 00945011 A 20000629