Global Patent Index - EP 1196820 A2

EP 1196820 A2 20020417 - METHOD FOR PRODUCTION OF THREE-DIMENSIONALLY ARRANGED CONDUCTING AND CONNECTING STRUCTURES FOR VOLUMETRIC AND ENERGY FLOWS

Title (en)

METHOD FOR PRODUCTION OF THREE-DIMENSIONALLY ARRANGED CONDUCTING AND CONNECTING STRUCTURES FOR VOLUMETRIC AND ENERGY FLOWS

Title (de)

VERFAHREN ZUR HERSTELLUNG DREIDIMENSIONAL ANGEORDNETER LEIT- UND VERBINDUNGSSTRUKTUREN FÜR VOLUMEN- UND ENERGIESTRÖME

Title (fr)

PROCEDE DE FABRICATION DE STRUCTURES CONDUCTRICES ET DE LIAISON DISPOSEES DE MANIERE TRIDIMENSIONNELLE, DESTINEES A DES FLUX VOLUMIQUES ET ENERGETIQUES

Publication

EP 1196820 A2 20020417 (DE)

Application

EP 00991054 A 20001208

Priority

  • DE 0004393 W 20001208
  • DE 19964099 A 19991231

Abstract (en)

[origin: WO0150198A2] The invention relates to a method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows. Various light-setting materials are used for the production of the layers. Upon exchanging the materials, those layer regions in which no setting occurred during the preceding setting process, are also filled with new material, such that, in the subsequent setting process, not only is the upper layer linked to the one lying directly beneath it, but also material of the upper layer is connected to the material of a layer lying below the penultimate layer. It is thus possible, within the layer sequence, to connect a structure with varying properties from layer to layer.

IPC 1-7

G03F 1/00

IPC 8 full level

H01L 21/268 (2006.01); B01J 4/00 (2006.01); B29C 67/00 (2006.01); G03F 7/00 (2006.01); H01L 23/538 (2006.01); H01P 3/12 (2006.01); H01P 11/00 (2006.01); H05K 3/00 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/46 (2006.01)

CPC (source: EP KR US)

B29C 64/135 (2017.07 - EP US); B81B 7/00 (2013.01 - KR); G03F 7/0035 (2013.01 - EP US); H05K 3/0023 (2013.01 - EP US); B29L 2011/0075 (2013.01 - EP US); B29L 2031/3061 (2013.01 - EP US); H05K 1/0272 (2013.01 - EP US); H05K 1/095 (2013.01 - EP US); H05K 3/02 (2013.01 - EP US); H05K 3/465 (2013.01 - EP US); H05K 3/4664 (2013.01 - EP US); H05K 3/4697 (2013.01 - EP US); H05K 2203/0568 (2013.01 - EP US)

Citation (search report)

See references of WO 0150198A2

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0150198 A2 20010712; WO 0150198 A3 20020117; AU 3150401 A 20010716; AU 757191 B2 20030206; CA 2362387 A1 20010712; CA 2362387 C 20070911; CN 1211197 C 20050720; CN 1358131 A 20020710; DE 19964099 A1 20010913; DE 19964099 B4 20060406; EP 1196820 A2 20020417; IS 6064 A 20010828; JP 2003519039 A 20030617; KR 100652036 B1 20061130; KR 20010105354 A 20011128; NO 20014209 D0 20010830; NO 20014209 L 20011025; NO 328157 B1 20091221; RU 2242063 C2 20041210; TW I248555 B 20060201; US 2002125612 A1 20020912; US 6805829 B2 20041019

DOCDB simple family (application)

DE 0004393 W 20001208; AU 3150401 A 20001208; CA 2362387 A 20001208; CN 00804479 A 20001208; DE 19964099 A 19991231; EP 00991054 A 20001208; IS 6064 A 20010828; JP 2001550494 A 20001208; KR 20017010676 A 20010822; NO 20014209 A 20010830; RU 2001126395 A 20001208; TW 89126539 A 20001213; US 91458501 A 20010829