EP 1196943 A1 20020417 - PROCESS FOR REMOVING CONTAMINANT FROM A SURFACE AND COMPOSITION USEFUL THEREFOR
Title (en)
PROCESS FOR REMOVING CONTAMINANT FROM A SURFACE AND COMPOSITION USEFUL THEREFOR
Title (de)
VERFAHREN FÜR DAS ENTFERNEN VON VERUNREINIGUNGEN VON DER OBERFLÄCHE UND DAFÜR NÜTZLICHE ZUSAMMENSETZUNGEN
Title (fr)
PROCEDE PERMETTANT D'ELIMINER DES CONTAMINANTS D'UNE SURFACE ET COMPOSITIONS UTILES A CET EFFET
Publication
Application
Priority
- US 0014181 W 20000523
- US 31881499 A 19990526
- US 53311400 A 20000322
Abstract (en)
[origin: WO0072363A1] Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt therof.
IPC 1-7
IPC 8 full level
C11D 7/28 (2006.01); H01L 21/02 (2006.01); C11D 3/02 (2006.01); C11D 3/20 (2006.01); C11D 7/08 (2006.01); C11D 7/10 (2006.01); C11D 7/26 (2006.01); C11D 11/00 (2006.01); H01L 21/304 (2006.01); H01L 21/3205 (2006.01); H01L 21/321 (2006.01); H01L 21/306 (2006.01)
CPC (source: EP KR)
C11D 3/042 (2013.01 - EP KR); C11D 3/046 (2013.01 - EP KR); C11D 3/2082 (2013.01 - EP KR); C11D 3/2086 (2013.01 - EP KR); C11D 7/08 (2013.01 - EP KR); C11D 7/10 (2013.01 - EP KR); C11D 7/265 (2013.01 - EP); H01L 21/02074 (2013.01 - EP KR); H01L 21/3212 (2013.01 - EP KR); C11D 2111/22 (2024.01 - EP KR)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0072363 A1 20001130; AU 5157100 A 20001212; CN 1158691 C 20040721; CN 1360733 A 20020724; EP 1196943 A1 20020417; EP 1196943 A4 20070117; IL 146733 A0 20020725; IL 146733 A 20050725; JP 2003500527 A 20030107; KR 100672874 B1 20070124; KR 20020030743 A 20020425; TW 463256 B 20011111
DOCDB simple family (application)
US 0014181 W 20000523; AU 5157100 A 20000523; CN 00808091 A 20000523; EP 00936223 A 20000523; IL 14673300 A 20000523; JP 2000620663 A 20000523; KR 20017015034 A 20011124; TW 89110192 A 20000703