EP 1197131 A1 20020417 - A VIA CONNECTOR AND METHOD OF MAKING SAME
Title (en)
A VIA CONNECTOR AND METHOD OF MAKING SAME
Title (de)
DURCHKONTAKTIERUNG UND HERSTELLUNGSMETHODE
Title (fr)
CONNECTEUR DE TRAVERSEE ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
US 9906729 W 19990329
Abstract (en)
[origin: WO0059276A1] An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The insulator substrate (12) and the sidewalls of the via are plated with conductive layer (14) and the via is filled with an electrically conductive fill composition (18). Conductive cap layers (20, 22) are formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
IPC 1-7
IPC 8 full level
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01); H05K 3/42 (2006.01)
CPC (source: EP)
H05K 1/113 (2013.01); H05K 1/114 (2013.01); H05K 3/4069 (2013.01); H05K 3/0094 (2013.01); H05K 3/246 (2013.01); H05K 3/426 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/0959 (2013.01)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0059276 A1 20001005; AU 3210999 A 20001016; EP 1197131 A1 20020417; EP 1197131 A4 20060719
DOCDB simple family (application)
US 9906729 W 19990329; AU 3210999 A 19990329; EP 99914213 A 19990329