EP 1198620 A1 20020424 - METHODS FOR WET PROCESSING ELECTRONIC COMPONENTS HAVING COPPER CONTAINING SURFACES
Title (en)
METHODS FOR WET PROCESSING ELECTRONIC COMPONENTS HAVING COPPER CONTAINING SURFACES
Title (de)
VERFAHREN ZUR NASSBEHANDLUNG VON ELEKTRONISCHEN BAUTEILEN MIT KUPFERENTHALTENDEN OBERFLÄCHEN
Title (fr)
PROCEDE DE TRAITEMENT PAR VOIE HUMIDE DE COMPOSANTS ELECTRONIQUES DONT LES SURFACES CONTIENNENT DU CUIVRE
Publication
Application
Priority
- US 0014019 W 20000519
- US 13526799 P 19990521
Abstract (en)
[origin: WO0071782A1] The present invention provides methods of wet processing electronic components having surfaces containing copper. In the methods of the present invention, copper containing electronic components are contacted with a copper oxidizing solution containing an oxidizing agent, and subsequently contacted with an etching solution. The methods of the present invention are particularly useful for cleaning copper containing components.
IPC 1-7
IPC 8 full level
C23F 3/00 (2006.01); C11D 3/39 (2006.01); C11D 11/00 (2006.01); C23F 1/18 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01)
CPC (source: EP KR)
C11D 3/3947 (2013.01 - EP KR); C23F 1/18 (2013.01 - EP KR); H01L 21/02052 (2013.01 - EP KR); H01L 21/32134 (2013.01 - EP KR); C11D 2111/22 (2024.01 - EP KR)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 0071782 A1 20001130; AU 5152200 A 20001212; CN 1352703 A 20020605; EP 1198620 A1 20020424; EP 1198620 A4 20041222; JP 2003500537 A 20030107; KR 20020030742 A 20020425; TW 466728 B 20011201
DOCDB simple family (application)
US 0014019 W 20000519; AU 5152200 A 20000519; CN 00807855 A 20000519; EP 00936165 A 20000519; JP 2000620153 A 20000519; KR 20017014820 A 20011120; TW 89109421 A 20000517