EP 1198745 A1 20020424 - COOLING DEVICE FOR ELECTRONIC COMPONENTS
Title (en)
COOLING DEVICE FOR ELECTRONIC COMPONENTS
Title (de)
KÜHLVORRICHTUNG FÜR ELEKTRONISCHE BAUELEMENTE
Title (fr)
DISPOSITIF DE REFROIDISSEMENT POUR COMPOSANTS ELECTRONIQUES
Publication
Application
Priority
- DE 10012990 A 20000316
- EP 0102631 W 20010308
Abstract (en)
[origin: WO0169360A1] The invention relates to a cooling device for electronic components, especially for cooling microprocessors. The inventive device has at least one passive heat-conducting cooling element (12). At least one part of the passive cooling element (12) is connected to at least one heat transmission medium (20) which is in a solid state of aggregation and is a phase change material (PCM) having a heat receiving capacity that is many times higher compared to water and is configured as a PCM device. The heat transmission medium (20) stores the heat quantity which is produced by charging the electronic component and cannot be received and discharged by the passive cooling element (18) any longer, whereby the solid state of aggregation is maintained. Said medium releases said heat when the electronic component is charged less.
IPC 1-7
IPC 8 full level
H05K 7/20 (2006.01); H01L 23/427 (2006.01)
CPC (source: EP)
H01L 23/427 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
See references of WO 0169360A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0169360 A1 20010920; CA 2374008 A1 20010920; CN 1364251 A 20020814; DE 10012990 A1 20011011; EP 1198745 A1 20020424; JP 2003527753 A 20030916; TW 499749 B 20020821
DOCDB simple family (application)
EP 0102631 W 20010308; CA 2374008 A 20010308; CN 01800534 A 20010308; DE 10012990 A 20000316; EP 01913851 A 20010308; JP 2001568171 A 20010308; TW 90106088 A 20010409