EP 1199129 A3 20040324 - Self-brazing materials for elevated temperature applications
Title (en)
Self-brazing materials for elevated temperature applications
Title (de)
Selbsthartlötende Werkstoffe für Hochtemperaturanwendungen
Title (fr)
Matériaux autobrasants pour applications à hautes températures
Publication
Application
Priority
- US 24077300 P 20001016
- US 97652001 A 20011012
Abstract (en)
[origin: EP1199129A2] This invention describes the roll bonding of Al and Ni-bearing Cu alloys to suitable substrates to produce self-brazing materials for the elevated temperature, aggressive environment application. The Al and Ni-bearing Cu alloyforthe self-brazing layers can be obtained by cladding layers of elemental Ni and Al to Cu. The Al content in the self-brazing layers can be varied from 2 to 100%. The Ni content in the self-brazing Cu alloy can be varied from 10 to 100%. Additional alloying elements in the commercial Cu alloys such as Fe, Cr, Si. Mn, Sn and Zn are unavoidable. Trace elements in the commercial alloys such as Pb, Ag and As will also affect the brazing and shall be reduced. <IMAGE>
IPC 1-7
IPC 8 full level
B23K 20/04 (2006.01); B23K 35/02 (2006.01); B23K 35/14 (2006.01); B32B 15/01 (2006.01); B23K 35/28 (2006.01); B23K 35/30 (2006.01)
CPC (source: EP US)
B23K 20/04 (2013.01 - EP US); B23K 35/0238 (2013.01 - EP US); B32B 15/01 (2013.01 - EP US); B32B 15/013 (2013.01 - EP US); B32B 15/017 (2013.01 - EP US); B23K 35/286 (2013.01 - EP US); B23K 35/302 (2013.01 - EP US); B23K 35/3033 (2013.01 - EP US); B23K 2101/14 (2018.07 - EP US); Y10T 428/1275 (2015.01 - EP US); Y10T 428/12757 (2015.01 - EP US); Y10T 428/12924 (2015.01 - EP US); Y10T 428/12979 (2015.01 - EP US)
Citation (search report)
- [X] US 3076260 A 19630205 - ROEHL EDWARD J
- [A] EP 0238433 A2 19870923 - UNITED TECHNOLOGIES CORP [US]
- [A] EP 0278030 A1 19880817 - NIPPON KOKAN KK [JP]
- [A] US 4340650 A 19820720 - PATTANAIK SURYA, et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1199129 A2 20020424; EP 1199129 A3 20040324; US 2002066769 A1 20020606; US 6783870 B2 20040831
DOCDB simple family (application)
EP 01811013 A 20011016; US 97652001 A 20011012