EP 1199152 A3 20040107 - Method and apparatus for adjusting the gap between the rollers in a glue applicator for corrugated board
Title (en)
Method and apparatus for adjusting the gap between the rollers in a glue applicator for corrugated board
Title (de)
Verfahren und Vorrichtung zur Regelung der Höhe eines Walzenspaltes einer Beleimungs-Vorrichtung für eine Wellpappe-Bahn
Title (fr)
Dispositif de réglage de l'espacement de cylindres dans une machine d'encollage de papier ondulé
Publication
Application
Priority
DE 10052372 A 20001020
Abstract (en)
[origin: EP1199152A2] The frame (1) contains a glue-applicator roller (5) rotarily driven on a center lengthwise axle (8), and a pressure roller (10) rotarily driven on a center lengthwise axle (11). A corrugated cardboard web (47) consisting of at least one covering web (50) and corrugated web (49) travels through the gap (53) between the glue-applicator and pressure rollers. A dynamometer (34) measures the actual force in the gap at right angles to the web. The height of the gap can be altered by an adjustment (36), and a regulator (43) compares the actual and nominal forces in the gap.
IPC 1-7
IPC 8 full level
B31F 1/24 (2006.01); B05C 1/08 (2006.01); B05C 11/10 (2006.01); B05D 1/28 (2006.01); B05D 3/00 (2006.01); B05D 3/12 (2006.01); B05D 7/00 (2006.01); B05D 7/24 (2006.01); B31F 1/28 (2006.01)
CPC (source: EP US)
B05C 1/083 (2013.01 - EP US); B31F 1/2818 (2013.01 - EP US)
Citation (search report)
- [XY] DE 19715174 A1 19981015 - PETERS W MASCHF [DE]
- [Y] US 5348612 A 19940920 - BUETIKOFER PETER [DE], et al
- [A] US 5415720 A 19950516 - SCHOENHAMMER REINER [DE], et al
- [A] US 3383234 A 19680514 - NIKKEL WILLEM A
- [A] EP 0825017 A1 19980225 - MITSUBISHI HEAVY IND LTD [JP]
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1199152 A2 20020424; EP 1199152 A3 20040107; DE 10052372 A1 20020502; JP 2002192637 A 20020710; US 2002046811 A1 20020425; US 6620455 B2 20030916
DOCDB simple family (application)
EP 01122994 A 20010926; DE 10052372 A 20001020; JP 2001316944 A 20011015; US 98279801 A 20011022