Global Patent Index - EP 1201109 A1

EP 1201109 A1 20020502 - METHOD OF INSTALLING HEAT SOURCE, AND MICRO HEAT PIPE MODULE

Title (en)

METHOD OF INSTALLING HEAT SOURCE, AND MICRO HEAT PIPE MODULE

Title (de)

VERFAHREN ZUR INSTALLATION EINER WÄRMEQUELLE UND EINES WÄRMEROHR-MODULES

Title (fr)

PROCEDE D'INSTALLATION DE SOURCE THERMIQUE ET MODULE A MICROCALODUCS

Publication

EP 1201109 A1 20020502 (EN)

Application

EP 00944073 A 20000629

Priority

  • FI 0000596 W 20000629
  • FI 991509 A 19990701

Abstract (en)

[origin: WO0103484A1] The invention relates to a method of installing a heat source generating thermal energy on a micro heat pipe module and to a micro heat pipe module. The micro heat pipe module (1) has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and the micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed. The side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is at least partly coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat source (2) generating thermal energy away from the heat source (2) generating thermal energy along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).

IPC 1-7

H05K 7/20; H01L 23/427

IPC 8 full level

F28D 15/02 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01)

CPC (source: EP US)

F28D 15/0233 (2013.01 - EP US); H01L 23/427 (2013.01 - EP US); F28D 2015/0225 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

C-Set (source: EP US)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 0103484A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0103484 A1 20010111; AU 5830900 A 20010122; EP 1201109 A1 20020502; FI 991509 A 20010102; US 2002121359 A1 20020905

DOCDB simple family (application)

FI 0000596 W 20000629; AU 5830900 A 20000629; EP 00944073 A 20000629; FI 991509 A 19990701; US 2694301 A 20011227