Global Patent Index - EP 1203400 A1

EP 1203400 A1 20020508 - A THIN FILM RESISTOR DEVICE AND A METHOD OF MANUFACTURE THEREFOR

Title (en)

A THIN FILM RESISTOR DEVICE AND A METHOD OF MANUFACTURE THEREFOR

Title (de)

DÜNNSCHICHTWIDERSTAND UND DESSEN HERSTELLUNGSVERFAHREN

Title (fr)

RESISTANCE EN COUCHE MINCE ET PROCEDE DE FABRICATION

Publication

EP 1203400 A1 20020508 (EN)

Application

EP 00948639 A 20000713

Priority

  • US 0019010 W 20000713
  • US 14369199 P 19990714

Abstract (en)

[origin: WO0106547A1] The present invention provides a thin film resistor and method of manufacture therefor. The thin film resistor comprises a resistive layer located on a first dielectric layer, first and second contact pads located on the resistive layer, and a second dielectric layer located over the resistive layer and the first and second contact pads. In an illustrative embodiment, the thin film resistor further includes a first interconnect that contacts the first contact pad and a second interconnect that contacts the second contact pad.

IPC 1-7

H01L 21/02; H01L 23/532; H01L 27/06; H01L 21/768; H01C 7/00; H01C 17/075

IPC 8 full level

H01C 7/00 (2006.01); H01C 17/075 (2006.01); H01C 17/08 (2006.01); H01L 21/02 (2006.01); H01L 23/522 (2006.01); H01L 27/08 (2006.01); H01L 23/532 (2006.01)

CPC (source: EP)

H01C 7/006 (2013.01); H01C 17/075 (2013.01); H01C 17/08 (2013.01); H01L 23/522 (2013.01); H01L 23/5228 (2013.01); H01L 27/0802 (2013.01); H01L 28/24 (2013.01); H01L 23/53223 (2013.01); H01L 2924/0002 (2013.01)

Citation (search report)

See references of WO 0106547A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0106547 A1 20010125; AU 6211000 A 20010205; EP 1203400 A1 20020508

DOCDB simple family (application)

US 0019010 W 20000713; AU 6211000 A 20000713; EP 00948639 A 20000713