EP 1204787 A2 20020515 - METHOD FOR CONTINUOUS NICKEL-PLATING OF AN ALUMINIUM CONDUCTOR AND CORRESPONDING DEVICE
Title (en)
METHOD FOR CONTINUOUS NICKEL-PLATING OF AN ALUMINIUM CONDUCTOR AND CORRESPONDING DEVICE
Title (de)
KONTINUIERLICHES VERNICKELN EINER ALUMINIUM-LEITER UND VORRICHTUNG DAZU
Title (fr)
PROCEDE DE NICKELAGE EN CONTINU D'UN CONDUCTEUR EN ALUMINIUM ET DISPOSITIF CORRESPONDANT
Publication
Application
Priority
- FR 0002061 W 20000718
- FR 9909690 A 19990722
Abstract (en)
[origin: US2002139685A1] A continuous nickel plating process for at least one aluminum conductor includes a pre-treatment step P that improves the adherence of a nickel coat, and an electrolytic nickel plating step N, and is characterized in that the contact properties of the conductor after the pre-treatment step P are sufficient to enable a mechanical electrical contact, and in that the nickel plating current (In=I1) is transmitted to the conductor through a mechanical electrical contact on the part of the conductor output from the pre-treatment step (P). The invention is also directed to a device including a nickel plating tank with a receptacle that can contain a nickel plating bath and at least one electrode called the anode, containing nickel, at least one electrical power supply to apply a voltage (V1) between the electrode, or each electrode, and the conductor or each conductor, and means for moving the conductor in the nickel plating bath. The device also includes at least one pre-treatment tank with a receptacle that may contain a pre-treatment bath and means for moving the conductor, or each conductor, in the pre-treatment bath, and mechanical contact means for applying the voltage on the part of the conductor or each conductor, output from the pre-treatment step (P).
IPC 1-7
IPC 8 full level
C25D 7/06 (2006.01); C25D 5/14 (2006.01); C25D 5/44 (2006.01)
CPC (source: EP US)
C25D 5/605 (2020.08 - EP US); C25D 7/0607 (2013.01 - EP US); C25D 5/44 (2013.01 - EP US)
Citation (search report)
See references of WO 0107685A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
US 2002139685 A1 20021003; US 6780303 B2 20040824; AT E291111 T1 20050415; DE 60018764 D1 20050421; DE 60018764 T2 20060413; EP 1204787 A2 20020515; EP 1204787 B1 20050316; ES 2238300 T3 20050901; FR 2796656 A1 20010126; FR 2796656 B1 20010817; WO 0107685 A2 20010201; WO 0107685 A3 20011025
DOCDB simple family (application)
US 5089602 A 20020118; AT 00953251 T 20000718; DE 60018764 T 20000718; EP 00953251 A 20000718; ES 00953251 T 20000718; FR 0002061 W 20000718; FR 9909690 A 19990722