Global Patent Index - EP 1208595 A2

EP 1208595 A2 20020529 - INTERCONNECT ASSEMBLIES AND METHODS

Title (en)

INTERCONNECT ASSEMBLIES AND METHODS

Title (de)

VERBINDUNGSSTRUKTUR UND METHODE

Title (fr)

ENSEMBLES D'INTERCONNEXION ET PROCEDES

Publication

EP 1208595 A2 20020529 (EN)

Application

EP 00950811 A 20000728

Priority

  • US 0020530 W 20000728
  • US 36485599 A 19990730
  • US 36478899 A 19990730

Abstract (en)

[origin: WO0109952A2] An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion conencted to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.

IPC 1-7

H01L 23/48; G01R 1/073; H01L 21/48

IPC 8 full level

H01L 23/52 (2006.01); H01L 21/3205 (2006.01); H01L 21/60 (2006.01); H01L 21/768 (2006.01); H01L 23/482 (2006.01); H05K 3/40 (2006.01)

CPC (source: EP KR)

H01L 23/48 (2013.01 - KR); H01L 23/4822 (2013.01 - EP); H01L 24/01 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01029 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/181 (2013.01 - EP); H05K 3/4092 (2013.01 - EP)

Citation (search report)

See references of WO 0109952A2

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

WO 0109952 A2 20010208; WO 0109952 A3 20011115; AU 6385600 A 20010219; EP 1208595 A2 20020529; JP 2003506873 A 20030218; KR 100733525 B1 20070628; KR 100807426 B1 20080225; KR 20020022139 A 20020325; KR 20070043856 A 20070425; TW 518916 B 20030121

DOCDB simple family (application)

US 0020530 W 20000728; AU 6385600 A 20000728; EP 00950811 A 20000728; JP 2001514483 A 20000728; KR 20027001207 A 20020129; KR 20077003992 A 20070220; TW 89115236 A 20000818