EP 1210733 A1 20020605 - METHOD FOR PRODUCING VIA-CONNECTIONS IN A SUBSTRATE AND SUBSTRATE EQUIPPED WITH SAME
Title (en)
METHOD FOR PRODUCING VIA-CONNECTIONS IN A SUBSTRATE AND SUBSTRATE EQUIPPED WITH SAME
Title (de)
HERSTELLUNG VON DURCHKONTAKTEN DURCH EIN SUBSTRAT
Title (fr)
PROCEDE DE FABRICATION DE CONNEXIONS TRAVERSANTES DANS UN SUBSTRAT ET SUBSTRAT EQUIPE DE TELLES CONNEXIONS
Publication
Application
Priority
- FR 0002065 W 20000718
- FR 9909938 A 19990730
Abstract (en)
[origin: FR2797140A1] The invention concerns a method for producing conductive via-connections in a substrate and substrates equipped with such connections. The method for producing conductive via-connections between the front face (2) and the rear face (3) of a substrate consists in: producing in the substrate (1) on the side of the rear face (3), cavities (5) with predetermined depth and cross-section for defining pads (4) with specific cross-section designed to ensure electrical conduction between the two faces (2, 3) and filling up the cavities (5) with a dielectric material (7). The substrate is equipped with conductive via-connections between its front face (2) and its rear face (3). The conductive connections are provided by the pads (4) defined by the cavities (5) filled with a dielectric material (7). The invention is particularly applicable to substrates used for making microsensors.
IPC 1-7
IPC 8 full level
H01L 21/768 (2006.01); H01L 23/48 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/04 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01)
CPC (source: EP US)
H01L 21/76898 (2013.01 - EP US); H01L 23/481 (2013.01 - EP US); H05K 3/0094 (2013.01 - EP US); H01L 2224/0557 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); H05K 1/0306 (2013.01 - EP US); H05K 3/045 (2013.01 - EP US); H05K 3/4076 (2013.01 - EP US); H05K 3/4608 (2013.01 - EP US); H05K 2201/0959 (2013.01 - EP US); H05K 2203/025 (2013.01 - EP US); H05K 2203/1338 (2013.01 - EP US)
C-Set (source: EP US)
Citation (examination)
- EP 0316799 A1 19890524 - NISSAN MOTOR [JP]
- WO 9844319 A1 19981008 - YAMATAKE HONEYWELL CO LTD [JP], et al & US 6353262 B1 20020305 - HONDA NOBUAKI [JP]
Citation (third parties)
Third party :
- US 6353262 B1 20020305 - HONDA NOBUAKI [JP]
- US 6475821 B2 20021105 - HONDA NOBUAKI [JP]
- See also references of WO 0109944A1
Designated contracting state (EPC)
AT BE CH DE FR GB LI
DOCDB simple family (publication)
FR 2797140 A1 20010202; FR 2797140 B1 20011102; EP 1210733 A1 20020605; US 6756304 B1 20040629; WO 0109944 A1 20010208
DOCDB simple family (application)
FR 9909938 A 19990730; EP 00953255 A 20000718; FR 0002065 W 20000718; US 3015702 A 20020130