Global Patent Index - EP 1211000 A3

EP 1211000 A3 20031217 - Method for the segmental bending of wire binding elements

Title (en)

Method for the segmental bending of wire binding elements

Title (de)

Verfahren zum sementartigen Biegen von Drahtbindeelementen

Title (fr)

Procédé pour le pliage en segments d'éléments de reliure en fil

Publication

EP 1211000 A3 20031217 (DE)

Application

EP 01126528 A 20011114

Priority

  • DE 10059344 A 20001129
  • DE 10141811 A 20010827

Abstract (en)

[origin: EP1211000A2] The flat loop-shaped wire binding element is bent into a C-shape in a segment fashion. Bending is carried out using a device (90) with two bending units (95, 95), each with at least one retaining part (91, 91), at least one support (92, 92) and at least one bending beam (93, 93), the two bending units being individually movable along the wire loops in a controlled manner. Two O-shaped dies (94, 94) are used to bend the C-shapes into O-shapes, which are used to hold brochure sheets together.

IPC 1-7

B21F 45/16; B42B 5/10

IPC 8 full level

B42F 13/16 (2006.01); B21D 11/00 (2006.01); B21F 1/00 (2006.01); B21F 37/00 (2006.01); B21F 45/16 (2006.01); B42B 5/08 (2006.01)

CPC (source: EP)

B21F 45/16 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1211000 A2 20020605; EP 1211000 A3 20031217; AT E350225 T1 20070115; CN 1365897 A 20020828; CZ 20013618 A3 20020717; DE 50111783 D1 20070215; EP 1211097 A2 20020605; EP 1211097 A3 20030129; EP 1211097 B1 20070103; JP 2002219541 A 20020806; JP 2002224775 A 20020813; JP 3986807 B2 20071003

DOCDB simple family (application)

EP 01126528 A 20011114; AT 01122587 T 20010926; CN 01134996 A 20011129; CZ 20013618 A 20011008; DE 50111783 T 20010926; EP 01122587 A 20010926; JP 2001363913 A 20011129; JP 2001364932 A 20011129