EP 1213372 B1 20110209 - Process and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses and use of the process
Title (en)
Process and arrangement for the galvanic deposition of nickel, cobalt, nickel alloys or cobalt alloys with periodic current pulses and use of the process
Title (de)
Verfahren und Anordnung zur galvanischen Abscheidung von Nickel, Kobalt, Nickellegierungen oder Kobaltlegierungen mit periodischen Strompulsen und Verwendung des Verfahrens
Title (fr)
Procédé et disposition pour la déposition galvanique de nickel, cobalt, d'alliages de nickel ou de cobalt grâce à des impulsions périodiques de courant et utilisation de ce procédé
Publication
Application
Priority
DE 10061186 A 20001207
Abstract (en)
[origin: US2002084190A1] A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one anode and at least one cathode of the bath are subject to periodic current pulses. The IA/IC ratio of the anode current density IA to the cathode current density IC is selected to be greater than 1 and smaller than 1.5. The charge ratio QA/QC=TAIA/TCIC of the charge QA, transported during an anode pulse of duration TA, to the charge QC transported during a cathode pulse of duration TC , is between 30 and 45. A bath for carrying out the method may have contoured anodes, current restrictors, a cleaning device for the electrolyte, and a circulating device with recycling of the electrolyte through nozzles.
IPC 8 full level
C25D 5/18 (2006.01); F02K 9/62 (2006.01); C25D 3/12 (2006.01); C25D 3/56 (2006.01); C25D 5/08 (2006.01); C25D 5/26 (2006.01); C25D 7/00 (2006.01); C25D 7/04 (2006.01); C25D 17/00 (2006.01); C25D 17/12 (2006.01); C25D 21/00 (2006.01); C25D 21/18 (2006.01)
CPC (source: EP US)
C25D 3/12 (2013.01 - EP US); C25D 3/562 (2013.01 - EP US); C25D 5/18 (2013.01 - EP US); C25D 17/00 (2013.01 - EP US); C25D 17/008 (2013.01 - EP US); C25D 17/12 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
US 2002084190 A1 20020704; US 6790332 B2 20040914; AT E498026 T1 20110215; DE 10061186 C1 20020117; DE 50115791 D1 20110324; EP 1213372 A2 20020612; EP 1213372 A3 20040204; EP 1213372 B1 20110209; JP 2002226991 A 20020814; JP 4285932 B2 20090624; RU 2281990 C2 20060820
DOCDB simple family (application)
US 1126901 A 20011207; AT 01128897 T 20011205; DE 10061186 A 20001207; DE 50115791 T 20011205; EP 01128897 A 20011205; JP 2001372829 A 20011206; RU 2001132956 A 20011206