Global Patent Index - EP 1214276 A1

EP 1214276 A1 20020619 - JOINING OF CVD DIAMOND BODIES TO METAL STRUCTURES

Title (en)

JOINING OF CVD DIAMOND BODIES TO METAL STRUCTURES

Title (de)

VERBINDEN VON CVD-DIAMANTKÖRPERN MIT METALLSTRUKTUREN

Title (fr)

FORMATION DE JOINT ENTRE DES CORPS DE DIAMANT DEPOSE ET DES STRUCTURES METALLIQUES

Publication

EP 1214276 A1 20020619 (EN)

Application

EP 00951792 A 20000825

Priority

  • GB 9920384 A 19990828
  • IB 0001172 W 20000825

Abstract (en)

[origin: WO0116051A1] The invention is concerned with a method of forming a joint between a CVD (chemical vapour deposition) diamond and a metal support structure, and with a joint formed by the method. In the method, a CVD diamond body (14) is bonded to a ceramic body (16) having thermal expansion characteristics compatible with those of CVD diamond. The ceramic body (16) is in turn bonded to a dimensionally compliant, intermediate metal element (18). The metal element is then secured to the metal supporting structure (12). Optimally, the intermediate metal element has thermal expansion characteristics between those of the ceramic body and the metal supporting structure. In one application, the joint may be used to mount the window in a gyrotron viewport flange.

IPC 1-7

C04B 37/02; H01P 1/08

IPC 8 full level

B23K 1/00 (2006.01); B23K 20/00 (2006.01); C04B 37/02 (2006.01); H01J 25/00 (2006.01); H01P 1/08 (2006.01)

CPC (source: EP)

C04B 37/006 (2013.01); C04B 37/026 (2013.01); H01P 1/08 (2013.01); C04B 2237/121 (2013.01); C04B 2237/341 (2013.01); C04B 2237/361 (2013.01); C04B 2237/363 (2013.01); C04B 2237/368 (2013.01); C04B 2237/403 (2013.01); C04B 2237/407 (2013.01); C04B 2237/408 (2013.01); C04B 2237/76 (2013.01); C04B 2237/765 (2013.01)

Citation (search report)

See references of WO 0116051A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0116051 A1 20010308; AU 6463700 A 20010326; CA 2383325 A1 20010308; EP 1214276 A1 20020619; GB 9920384 D0 19991103; JP 2003508330 A 20030304

DOCDB simple family (application)

IB 0001172 W 20000825; AU 6463700 A 20000825; CA 2383325 A 20000825; EP 00951792 A 20000825; GB 9920384 A 19990828; JP 2001519622 A 20000825