EP 1216487 A1 20020626 - SEMICONDUCTOR WAFER LEVEL PACKAGE
Title (en)
SEMICONDUCTOR WAFER LEVEL PACKAGE
Title (de)
HALBLEITERVERPACKUNG AUF WAFEREBENE
Title (fr)
BOITIER SUR TRANCHE (WLP) DE SEMICONDUCTEUR
Publication
Application
Priority
- US 0025315 W 20000915
- US 15440099 P 19990917
Abstract (en)
[origin: WO0120671A1] A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer (11) before dicing of the wafer into individual chips. A cap wafer (16) may be bonded to the semiconductor subtrate using a low temperature frit glass layer (14) as a bonding agent. The frit glass layer (14) is in direct contact with the device. A hermetic seal is formed by a combination of the semiconductor substrate wafer (11), the cap wafer (16) and the first glass layer (14). A second embodiment of the package (21) does not contain a cap wafer.
IPC 1-7
H01L 23/04; H01L 23/10; H01L 21/56; H01L 23/29; H01L 21/52; H01L 21/54
IPC 8 full level
H01L 21/52 (2006.01); H01L 21/54 (2006.01); H01L 21/56 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/29 (2006.01)
CPC (source: EP)
H01L 21/52 (2013.01); H01L 21/54 (2013.01); H01L 21/56 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/291 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
See references of WO 0120671A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 0120671 A1 20010322; AU 7381200 A 20010417; EP 1216487 A1 20020626
DOCDB simple family (application)
US 0025315 W 20000915; AU 7381200 A 20000915; EP 00961925 A 20000915