EP 1218569 A1 20020703 - GALVANIZING SOLUTION FOR THE GALVANIC DEPOSITION OF COPPER
Title (en)
GALVANIZING SOLUTION FOR THE GALVANIC DEPOSITION OF COPPER
Title (de)
GALVANISIERUNGSLÖSUNG FÜR DIE GALVANISCHE ABSCHEIDUNG VON KUPFER
Title (fr)
SOLUTION DE GALVANISATION POUR LE DEPOT GALVANIQUE DE CUIVRE
Publication
Application
Priority
- DE 19941605 A 19990901
- EP 0008312 W 20000825
Abstract (en)
[origin: US6858123B1] The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic deposition of copper which is used in the manufacture of semiconductors.
IPC 1-7
IPC 8 full level
C25D 3/38 (2006.01); C25D 7/12 (2006.01); H01L 21/28 (2006.01); H01L 21/288 (2006.01)
CPC (source: EP KR US)
C25D 3/38 (2013.01 - EP KR US)
Citation (search report)
See references of WO 0116403A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
US 6858123 B1 20050222; AT E233330 T1 20030315; AU 7413600 A 20010326; DE 19941605 A1 20010315; DE 50001349 D1 20030403; EP 1218569 A1 20020703; EP 1218569 B1 20030226; JP 2003508630 A 20030304; JP 4416979 B2 20100217; KR 100737511 B1 20070709; KR 20020029933 A 20020420; MY 124024 A 20060630; TW I230208 B 20050401; WO 0116403 A1 20010308
DOCDB simple family (application)
US 7000002 A 20021127; AT 00962386 T 20000825; AU 7413600 A 20000825; DE 19941605 A 19990901; DE 50001349 T 20000825; EP 0008312 W 20000825; EP 00962386 A 20000825; JP 2001519943 A 20000825; KR 20027002623 A 20020227; MY PI20004015 A 20000830; TW 89117408 A 20000828