EP 1220739 A1 20020710 - METHOD AND DEVICE FOR ISOLATING PLATE-LIKE SUBSTRATES
Title (en)
METHOD AND DEVICE FOR ISOLATING PLATE-LIKE SUBSTRATES
Title (de)
VERFAHREN UND EINRICHTUNG ZUM VEREINZELN VON SCHEIBENFÖRMIGEN SUBSTRATEN
Title (fr)
PROCEDE ET DISPOSITIF POUR SEPARER DES SUBSTRATS EN FORME DE TRANCHE
Publication
Application
Priority
- DE 19950068 A 19991016
- EP 0010036 W 20001012
Abstract (en)
[origin: WO0128745A1] The invention relates to a method for isolating and detaching thin, fragile, plate-like substrates (11). Said plate-like substrates (11) are cut from a substrate block (13), which is preferably mounted on a baseplate (12) by means of adhesive, are gripped at evenly distributed points on the free outer surface thereof (16) and are displaced in an oscillating manner, such that the plate-like substrates (11) are automatically and individually removed free of damage from the sawn substrate block and from the layer of adhesive.
IPC 1-7
IPC 8 full level
B28D 5/04 (2006.01); B28D 5/00 (2006.01); B65G 49/07 (2006.01)
CPC (source: EP)
B28D 5/0082 (2013.01); B28D 5/0094 (2013.01)
Citation (search report)
See references of WO 0128745A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0128745 A1 20010426; AT E294056 T1 20050515; AU 1136801 A 20010430; AU 777067 B2 20040930; CA 2388730 A1 20010426; CN 1160177 C 20040804; CN 1379708 A 20021113; DE 19950068 A1 20010426; DE 19950068 B4 20060302; DE 50010186 D1 20050602; EP 1220739 A1 20020710; EP 1220739 B1 20050427; ES 2240189 T3 20051016; JP 2003512196 A 20030402; JP 4731077 B2 20110720
DOCDB simple family (application)
EP 0010036 W 20001012; AT 00972741 T 20001012; AU 1136801 A 20001012; CA 2388730 A 20001012; CN 00814371 A 20001012; DE 19950068 A 19991016; DE 50010186 T 20001012; EP 00972741 A 20001012; ES 00972741 T 20001012; JP 2001531562 A 20001012