Global Patent Index - EP 1222321 B1

EP 1222321 B1 20040204 - METHOD AND DEVICE FOR THE ELECTROLYTIC TREATMENT OF ELECTRICALLY CONDUCTING SURFACES SEPARATED PLATES AND FILM MATERIAL PIECES IN ADDITION TO USES OF SAID METHOD

Title (en)

METHOD AND DEVICE FOR THE ELECTROLYTIC TREATMENT OF ELECTRICALLY CONDUCTING SURFACES SEPARATED PLATES AND FILM MATERIAL PIECES IN ADDITION TO USES OF SAID METHOD

Title (de)

VERFAHREN UND VORRICHTUNG ZUM ELEKTROLYTISCHEN BEHANDELN VON ELEKTRISCH LEITFÄHIGEN OBERFLÄCHEN VON GEGENEINANDER VEREINZELTEN PLATTEN- UND FOLIENMATERIALSTÜCKEN SOWIE ANWENDUNGEN DES VERFAHRENS

Title (fr)

PROCEDE ET DISPOSITIF DE TRAITEMENT ELECTROLYTIQUE DE SURFACES ELECTROCONDUCTRICES DE PIECES EN CARTES OU EN FILMS SEPAREES ET APPLICATIONS DE CE PROCEDE

Publication

EP 1222321 B1 20040204 (DE)

Application

EP 00975832 A 20001005

Priority

  • DE 0003569 W 20001005
  • DE 19951324 A 19991020

Abstract (en)

[origin: US6939455B1] For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3 . The sheets and foils are guided during transportation past at least one electrode arrangement, which comprises respectively cathodically polarized electrodes 6 and anodically polarized electrodes 7 , the cathodically and anodically polarized electrodes also being brought in contact with the treatment fluid. The cathodically polarized electrodes and the anodically polarized electrodes are connected to a current/voltage source 8 , so that a current flows through the electrodes 6, 7 and the electrically conductive surfaces 4.

IPC 1-7

C25D 5/18; C25D 17/00

IPC 8 full level

C25D 7/06 (2006.01); C25D 5/00 (2006.01); C25D 5/18 (2006.01); C25D 17/00 (2006.01); C25D 17/28 (2006.01); C25D 19/00 (2006.01); C25F 7/00 (2006.01); H05K 3/24 (2006.01)

CPC (source: EP KR US)

C25D 7/00 (2013.01 - KR); C25D 7/0621 (2013.01 - EP KR US); C25D 17/28 (2013.01 - EP KR US); H05K 3/241 (2013.01 - EP US); H05K 3/241 (2013.01 - KR)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

US 6939455 B1 20050906; AT E259004 T1 20040215; AU 1381801 A 20010430; BR 0014875 A 20020618; CA 2384249 A1 20010426; CN 1302155 C 20070228; CN 1382232 A 20021127; DE 19951324 A1 20010503; DE 19951324 C2 20030717; DE 50005225 D1 20040311; EP 1222321 A1 20020717; EP 1222321 B1 20040204; EP 1222321 B9 20041110; HK 1044806 A1 20021101; HK 1044806 B 20040528; JP 2003520291 A 20030702; JP 4521147 B2 20100811; KR 100729973 B1 20070620; KR 20020042730 A 20020605; MX PA02002604 A 20030128; TW 562879 B 20031121; WO 0129290 A1 20010426

DOCDB simple family (application)

US 11057002 A 20020412; AT 00975832 T 20001005; AU 1381801 A 20001005; BR 0014875 A 20001005; CA 2384249 A 20001005; CN 00814609 A 20001005; DE 0003569 W 20001005; DE 19951324 A 19991020; DE 50005225 T 20001005; EP 00975832 A 20001005; HK 02106459 A 20020902; JP 2001532268 A 20001005; KR 20027005026 A 20020419; MX PA02002604 A 20001005; TW 89121826 A 20001018