EP 1224688 A1 20020724 - METHOD AND DEVICE FOR THERMAL TREATMENT OF SUBSTRATES
Title (en)
METHOD AND DEVICE FOR THERMAL TREATMENT OF SUBSTRATES
Title (de)
VERFAHREN UND VORRICHTUNG ZUM THERMISCHEN BEHANDELN VON SUBSTRATEN
Title (fr)
PROCEDE ET DISPOSITIF POUR LE TRAITEMENT THERMIQUE DE SUBSTRATS
Publication
Application
Priority
- DE 19952017 A 19991028
- EP 0010290 W 20001019
Abstract (en)
[origin: DE19952017A1] In order to achieve temperature distribution, in particular a homogeneous temperature distribution in, for example, a substrate during a thermal treatment process of said substrate, a method is disclosed for the thermal treatment of substrates, in particular semi-conductor wafers, in a process chamber comprising at least one temperature distribution influencing element located in the process chamber. During thermal treatment, the spatial arrangement of the element is altered relative to the substrate and/or to the process chamber. A device for the thermal treatment of substrates in a process chamber is also disclosed, comprising at least one temperature distribution influencing element located in a process chamber wherein a device is provided in order to alter the spatial arrangement of the element relative to the substrate and/or to the process chamber during the thermal treatment process.
IPC 1-7
IPC 8 full level
H01L 21/26 (2006.01); H01L 21/00 (2006.01)
CPC (source: EP KR US)
H01L 21/324 (2013.01 - KR); H01L 21/67115 (2013.01 - EP US)
Citation (search report)
See references of WO 0131689A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DE 19952017 A1 20010517; EP 1224688 A1 20020724; JP 2003513442 A 20030408; JP 5144867 B2 20130213; KR 100703259 B1 20070403; KR 20020043256 A 20020608; TW 483070 B 20020411; US 7041610 B1 20060509; WO 0131689 A1 20010503
DOCDB simple family (application)
DE 19952017 A 19991028; EP 0010290 W 20001019; EP 00972808 A 20001019; JP 2001534189 A 20001019; KR 20027005516 A 20020429; TW 89122630 A 20010129; US 11173702 A 20020917