EP 1226395 A4 20080220 - HOT WALL RAPID THERMAL PROCESSOR

Title (en)

HOT WALL RAPID THERMAL PROCESSOR

Title (de)

VORRICHTUNG ZUR SCHNELLEN THERMISCHEN BEHANDLUNG ÜBER AUFGEHEIZTE WÄNDE

Title (fr)

DISPOSITIF DE TRAITEMENT THERMIQUE RAPIDE PAR PAROI CHAUDE

Publication

EP 1226395 A4 20080220 (EN)

Application

EP 00957426 A 20000811

Priority

US 0022202 W 20000811
US 37389499 A 19990812
US 21732100 P 20000707

Abstract (en)

[origin: WO0113054A1] An apparatus (10) for heat treatment of a wafer (28) is disclosed. The apparatus includes a heating chamber (18) having a heat source (20). A cooling chamber (32) is positioned adjacent to the heating chamber and includes a cooling source (40). A wafer holder (38) is configured to move between the cooling chamber and the heating chamber through a passageway (54) and one or more shutters (52) defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

IPC 8 full level

F27B 5/14 (2006.01); F27D 3/12 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C30B 25/10 (2006.01); C30B 25/14 (2006.01); F27B 5/06 (2006.01); F27D 7/02 (2006.01); F27D 9/00 (2006.01); H01L 21/00 (2006.01); H01L 21/205 (2006.01); H01L 21/324 (2006.01); F27B 5/16 (2006.01); F27D 1/18 (2006.01); F27D 3/00 (2006.01)

CPC (source: EP KR)

C23C 16/455 (2013.01 - EP); C23C 16/4584 (2013.01 - EP); C23C 16/463 (2013.01 - EP); C30B 25/10 (2013.01 - EP); C30B 25/14 (2013.01 - EP); H01L 21/324 (2013.01 - KR); H01L 21/67109 (2013.01 - EP); F27B 5/14 (2013.01 - EP); F27B 2005/161 (2013.01 - EP); F27D 1/1858 (2013.01 - EP); F27D 2003/0075 (2013.01 - EP)

Citation (search report)

[X] US 5651670 A 19970729 - OKASE WATARU [JP], et al
[X] US 5520742 A 19960528 - OHKASE WATARU [JP]
[XP] US 6056544 A 20000502 - CHO JUN-GEOL [KR]
[A] US 5908292 A 19990601 - SMITH JOHN Z [US], et al
See references of WO 0113054A1

Designated contracting state (EPC)

DE FR GB IT NL

DOCDB simple family (publication)

WO 0113054 A1 20010222; AU 6904700 A 20010313; CN 1420978 A 20030528; EP 1226395 A1 20020731; EP 1226395 A4 20080220; JP 2003507881 A 20030225; KR 20020030093 A 20020422; TW 473785 B 20020121

DOCDB simple family (application)

US 0022202 W 20000811; AU 6904700 A 20000811; CN 00812823 A 20000811; EP 00957426 A 20000811; JP 2001517110 A 20000811; KR 20027001786 A 20020208; TW 89116281 A 20000811