EP 1227061 A3 20040303 - Process for the manufacture of a micromechanical device
Title (en)
Process for the manufacture of a micromechanical device
Title (de)
Herstellungsverfahren für ein mikromechanisches Bauelement
Title (fr)
Procédé de fabrication d'un dispositif microméchanique
Publication
Application
Priority
DE 10102993 A 20010124
Abstract (en)
[origin: DE10102993A1] Production of a micromechanical component comprises preparing a substrate with a front side and a rear side, structuring the front side of the substrate; partially covering the structured front side with a protective layer (7) containing germanium, and structuring the rear side of the substrate and partially removing the protective layer. Preferably the substrate is a wafer substrate consists of a wafer (1), a sacrificial layer (2) and a micromechanical functional layer (4). A hard mask (5, 6) is formed on the front side of the substrate.
IPC 1-7
IPC 8 full level
CPC (source: EP US)
B81C 1/00896 (2013.01 - EP US); B81C 2201/053 (2013.01 - EP US)
Citation (search report)
- [X] US 5985164 A 19991116 - CHU WEN-HUA [US], et al
- [PX] DE 19939318 A1 20010222 - BOSCH GMBH ROBERT [DE]
- [A] EP 0867702 A2 19980930 - IMEC INTER UNI MICRO ELECTR [BE]
- [A] LI B ET AL: "GERMANIUM AS A VERSATILE MATERIAL FOR LOW-TEMPERATURE MICROMACHINING", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE INC. NEW YORK, US, vol. 8, no. 4, December 1999 (1999-12-01), pages 366 - 372, XP000964020, ISSN: 1057-7157
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1227061 A2 20020731; EP 1227061 A3 20040303; DE 10102993 A1 20020725; DE 10102993 B4 20090108; JP 2002283294 A 20021003; US 2002119589 A1 20020829; US 6905615 B2 20050614
DOCDB simple family (application)
EP 01127971 A 20011124; DE 10102993 A 20010124; JP 2002014073 A 20020123; US 5745502 A 20020124