Global Patent Index - EP 1228266 A1

EP 1228266 A1 20020807 - METHOD FOR ELECTROCHEMICALLY METALLISING AN INSULATING SUBSTRATE

Title (en)

METHOD FOR ELECTROCHEMICALLY METALLISING AN INSULATING SUBSTRATE

Title (de)

VERFAHREN ZUR ELEKTROCHEMISCHEN METALLISIERUNG EINES ISOLIERENDEN SUBSTRATS

Title (fr)

PROCEDE DE METALLISATION D'UN SUBSTRAT ISOLANT PAR VOIE ELECTROCHIMIQUE

Publication

EP 1228266 A1 20020807 (FR)

Application

EP 00966282 A 20001004

Priority

  • FR 0002757 W 20001004
  • FR 9912644 A 19991011

Abstract (en)

[origin: US6764586B1] Provided is a process for metallizing an insulating substrate by depositing a uniform thin film of a metal on the insulating substrate. The process comprises placing the insulating substrate in an electrochemical cell which contains as the electrolyte a solution of a salt of the metal in a solvent, and which comprises an anode of the metal and a cathode in direct contact with the insulating substrate. A conducting film, which will constitute the cathode, is initially applied to one end of the substrate. The substrate is placed in the electrochemical cell in such a way that the surface to be metallized is vertical and the cathode is located in the upper part. A current is imposed on the electrochemical cell with an intensity such that it creates a current density of between 1 and 50 mA/cm<2 >in the horizontal section of the electrochemical cell level with the growth front of the film which is deposited.

IPC 1-7

C25D 5/54

IPC 8 full level

C25D 5/54 (2006.01); H05K 3/00 (2006.01)

CPC (source: EP US)

C25D 5/54 (2013.01 - EP US); C25D 5/56 (2013.01 - EP US)

Citation (search report)

See references of WO 0127356A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL

DOCDB simple family (publication)

US 6764586 B1 20040720; AT E259006 T1 20040215; AU 7672900 A 20010423; CA 2387109 A1 20010419; CA 2387109 C 20110524; DE 60008134 D1 20040311; DE 60008134 T2 20040902; EP 1228266 A1 20020807; EP 1228266 B1 20040204; ES 2213047 T3 20040816; FR 2799475 A1 20010413; FR 2799475 B1 20020201; JP 2003511564 A 20030325; JP 4637429 B2 20110223; WO 0127356 A1 20010419

DOCDB simple family (application)

US 11012602 A 20020409; AT 00966282 T 20001004; AU 7672900 A 20001004; CA 2387109 A 20001004; DE 60008134 T 20001004; EP 00966282 A 20001004; ES 00966282 T 20001004; FR 0002757 W 20001004; FR 9912644 A 19991011; JP 2001529484 A 20001004