Global Patent Index - EP 1230034 A4

EP 1230034 A4 20030108 - PROCESS FOR THE NON-GALVANIC TIN PLATING OF COPPER OR COPPER ALLOYS

Title (en)

PROCESS FOR THE NON-GALVANIC TIN PLATING OF COPPER OR COPPER ALLOYS

Title (de)

VERFAHREN ZUR STROMLOSEN VERZINNUNG VON KUPFER ODER KUPFERLEGIERUNGEN

Title (fr)

PROCEDE DESTINE A L'ETAMAGE NON GALVANIQUE DU CUIVRE OU D'ALLIAGES DE CUIVRE

Publication

EP 1230034 A4 20030108 (EN)

Application

EP 00978519 A 20001109

Priority

  • DE 19954613 A 19991112
  • US 0030983 W 20001109

Abstract (en)

[origin: DE19954613A1] The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the tin layer.

IPC 1-7

B05D 1/18; C23C 18/31; C23C 18/48

IPC 8 full level

B05D 7/14 (2006.01); C23C 18/31 (2006.01); C23C 18/48 (2006.01)

CPC (source: EP)

C23C 18/31 (2013.01); C23C 18/48 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

DE 19954613 A1 20010517; AT 480340 T 20100915; AU 1597501 A 20010606; CN 1192125 C 20050309; CN 1387465 A 20021225; DE 60044943 D1 20101021; EP 1230034 A1 20020814; EP 1230034 A4 20030108; EP 1230034 B1 20100908; JP 2003514120 A 20030415; JP 4084569 B2 20080430; WO 0134310 A1 20010517

DOCDB simple family (application)

DE 19954613 A 19991112; AT 00978519 T 20001109; AU 1597501 A 20001109; CN 00815462 A 20001109; DE 60044943 T 20001109; EP 00978519 A 20001109; JP 2001536299 A 20001109; US 0030983 W 20001109