EP 1232092 A1 20020821 - METHOD FOR ENCAPSULATING A TOPICAL COMPOSITION
Title (en)
METHOD FOR ENCAPSULATING A TOPICAL COMPOSITION
Title (de)
VERFAHREN ZUR EINKAPSELUNG EINER TOPISCHEN ZUSAMMENSETZUNG
Title (fr)
PROCEDE D'ENCAPSULATION D'UNE COMPOSITION TOPIQUE
Publication
Application
Priority
- FR 0003246 W 20001122
- FR 9914729 A 19991123
Abstract (en)
[origin: US6823649B1] A method of encapsulating a topical composition in a breakable capsule, includes the steps of elastically deforming at least a portion of a first deformable film that is impermeable to the composition so as to constitute at least one blister; injecting the topical composition into the blister; applying a second film that is impermeable to the composition onto the first film so as to close the blister; and sealing the second film and the first film together around the periphery of the blister, the portion of the first film being suitable for shrinking after release of the capsule so as to cause the pressure inside the capsule to be greater than atmospheric pressure. While the capsule is being made, at least one weak region is made in the blister, thus making the capsule suitable for being broken by exerting pressure on the capsule.
IPC 1-7
IPC 8 full level
A45D 37/00 (2006.01); A61J 3/07 (2006.01); B65B 9/04 (2006.01); B65B 47/02 (2006.01); B65B 61/02 (2006.01)
CPC (source: EP US)
B65B 9/042 (2013.01 - EP US); B65B 61/02 (2013.01 - EP US)
Citation (search report)
See references of WO 0138174A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
US 6823649 B1 20041130; AT E285357 T1 20050115; AU 1869901 A 20010604; DE 60016967 D1 20050127; EP 1232092 A1 20020821; EP 1232092 B1 20041222; FR 2801179 A1 20010525; FR 2801179 B1 20020830; JP 2003514639 A 20030422; JP 4102069 B2 20080618; WO 0138174 A1 20010531
DOCDB simple family (application)
US 12997402 A 20020724; AT 00981457 T 20001122; AU 1869901 A 20001122; DE 60016967 T 20001122; EP 00981457 A 20001122; FR 0003246 W 20001122; FR 9914729 A 19991123; JP 2001539745 A 20001122