Global Patent Index - EP 1234928 A3

EP 1234928 A3 20030226 - Floor covering to cover dismountable floor panels, floor construction with floor covering and its method of manufacture

Title (en)

Floor covering to cover dismountable floor panels, floor construction with floor covering and its method of manufacture

Title (de)

Bodenbelag für die Abdeckung von demontierbaren Bodenplatten, Bodenkonstruktion mit Bodenbelag und Verfahren zur Herstellung des Bodenbelags

Title (fr)

Revêtement de sol pour le recouvrement de panneaux de planchers démontables, structure de sols avec revêtement de sol et son procédé de production

Publication

EP 1234928 A3 20030226 (DE)

Application

EP 02004548 A 20020227

Priority

  • DE 10109389 A 20010227
  • US 25476202 A 20020926

Abstract (en)

[origin: EP1234928A2] Floor covering (6) for covering removable floor tiles (1), especially false floors, comprises a ventilated, conductive fixing adhesive (2) uniformly applied on the underside and protected from drying out on the outside by a covering film. Independent claims are also included for a floor construction comprising the above floor covering and for a process for producing the above floor covering. Preferred Features: The fixing adhesive is an acrylate dispersion with an electroconductive additive. The floor covering is designed as a roll of floor tiles.

IPC 1-7

E04F 15/024; E04F 15/02

IPC 8 full level

E04F 15/02 (2006.01); E04F 15/024 (2006.01)

CPC (source: EP US)

E04F 15/02 (2013.01 - EP US); E04F 15/024 (2013.01 - EP US); E04F 15/02405 (2013.01 - EP US)

Citation (search report)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1234928 A2 20020828; EP 1234928 A3 20030226; DE 10109389 A1 20020905; US 2004060254 A1 20040401

DOCDB simple family (application)

EP 02004548 A 20020227; DE 10109389 A 20010227; US 25476202 A 20020926