EP 1235947 A1 20020904 - METHOD AND APPARATUS FOR SUBSTRATE BIASING IN MULTIPLE ELECTRODE SPUTTERING SYSTEMS
Title (en)
METHOD AND APPARATUS FOR SUBSTRATE BIASING IN MULTIPLE ELECTRODE SPUTTERING SYSTEMS
Title (de)
VERFAHREN UND VORRICHTUNG ZUR POLARISATION VON SUBSTRAT IN MEHRFACHELEKTRODEN-SPUTTERING-SYSTEMEN
Title (fr)
TECHNIQUE ET DISPOSITIF DE POLARISATION DU SUBSTRAT DANS DES SYSTEMES DE PULVERISATION A ELECTRODES IN MULTIPLES
Publication
Application
Priority
- US 0028482 W 20001013
- US 15989699 P 19991015
Abstract (en)
[origin: WO0129278A1] A method and an apparatus are disclosed for causing ion bombardment of the substrate (3) during sputter deposition of an insulating or conducting material on a substrate (3) when using dual cathode (9, 10) or dual anode sputtering approaches. A novel electrical circuit including a center-tapped transformer (17) is disclosed to permit a controllable potential to be applied to the substrate (3) relative to the plasma potential, without the necessity of an additional power supply. Also disclosed are approaches which permit the use of an biasing supply (19 or 20), either dc or high frequency ac, and which can permit continuous discharging of the surface through alternate ion and electron bombardment.
IPC 1-7
IPC 8 full level
C23C 14/34 (2006.01); H01L 21/31 (2006.01)
CPC (source: EP KR)
C23C 14/3442 (2013.01 - KR); C23C 14/345 (2013.01 - EP KR); C23C 14/3464 (2013.01 - EP); C23C 14/548 (2013.01 - KR); H01J 37/32706 (2013.01 - EP); H01J 37/3444 (2013.01 - EP)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0129278 A1 20010426; EP 1235947 A1 20020904; EP 1235947 A4 20090415; JP 2003512526 A 20030402; KR 20020040875 A 20020530
DOCDB simple family (application)
US 0028482 W 20001013; EP 00970916 A 20001013; JP 2001532257 A 20001013; KR 20027004818 A 20020415