Global Patent Index - EP 1236540 A2

EP 1236540 A2 20020904 - Wafer abrasive machine

Title (en)

Wafer abrasive machine

Title (de)

Halbleiterplatteschleifvorrichtung

Title (fr)

Dispositif de polissage de plaquette semiconductrice

Publication

EP 1236540 A2 20020904 (EN)

Application

EP 02251319 A 20020226

Priority

JP 2001055177 A 20010228

Abstract (en)

In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer (W) can be corresponded while abrading the wafer (W) and a holding plate (10) can be smoothly moved in a head member (24). The abrasive machine comprises: the head member (24) including a concave section (26), in which the holding plate (10) is accommodated; an elastic sheet member (38) suspending the holding plate (10), the elastic sheet member (38) being reinforced by a cloth-formed reinforcing member (41); a space (50) for storing pressure fluid which pushes the holding plate (10) toward the abrasive plate (20), the space (50) being formed between the elastic sheet member (38) and the concave section (26); and a plurality of spherical bodies (9) being provided between an outer face (10a) of the holding plate (10) and an inner face (24a) of the concave section (26), the spherical bodies (9) simultaneously point-contact the both circumferential faces (10a, 24a). <IMAGE>

IPC 1-7

B24B 37/04

IPC 8 full level

B24B 37/00 (2006.01); B24B 37/005 (2012.01); B24B 37/04 (2006.01); B24B 37/30 (2012.01); H01L 21/304 (2006.01)

CPC (source: EP KR US)

B24B 37/30 (2013.01 - EP US); H01L 21/304 (2013.01 - KR)

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

EP 1236540 A2 20020904; EP 1236540 A3 20040128; EP 1236540 B1 20070912; DE 60222314 D1 20071025; DE 60222314 T2 20080605; JP 2002261056 A 20020913; JP 3294600 B1 20020624; KR 100841491 B1 20080625; KR 20020070136 A 20020905; MY 122893 A 20060531; TW 590845 B 20040611; US 2002119735 A1 20020829; US 6692342 B2 20040217

DOCDB simple family (application)

EP 02251319 A 20020226; DE 60222314 T 20020226; JP 2001055177 A 20010228; KR 20020010390 A 20020227; MY PI20020681 A 20020227; TW 91103403 A 20020226; US 8149302 A 20020222