Global Patent Index - EP 1238409 A1

EP 1238409 A1 2002-09-11 - METHOD AND DEVICE FOR TREATING SUBSTRATES

Title (en)

METHOD AND DEVICE FOR TREATING SUBSTRATES

Title (de)

VERFAHREN UND VORRICHTUNG ZUM BEHANDELN VON SUBSTRATEN

Title (fr)

PROCEDE ET DISPOSITIF POUR TRAITER DES SUBSTRATS

Publication

EP 1238409 A1 (DE)

Application

EP 00964220 A

Priority

  • DE 19948630 A
  • EP 0009249 W

Abstract (en)

[origin: DE19948630A1] The aim of the invention is to easily and cost-effectively prevent substrates from being damaged by virtue of long sojourn times in a treatment fluid. The present invention relates to a method for treating substrates, especially semiconductor wafers in a treatment basin that is filled with a treatment fluid. A fluid which dilutes the treatment fluid is inserted into the treatment basin when malfunctioning occurs. The invention also relates to a corresponding device for treating substrates.

IPC 1-7 (main, further and additional classification)

H01L 21/00

IPC 8 full level (invention and additional information)

H01L 21/306 (2006.01); H01L 21/00 (2006.01); H01L 21/304 (2006.01)

CPC (invention and additional information)

H01L 21/67086 (2013.01); H01L 21/67057 (2013.01); H01L 21/6708 (2013.01)

Citation (search report)

See references of WO 0127973A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

DE 19948630 A1 20010503; EP 1238409 A1 20020911; JP 2003511870 A 20030325; WO 0127973 A1 20010419

INPADOC legal status


2004-01-02 [18W] APPLICATION WITHDRAWN

- Effective date: 20031106

2002-09-11 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20020426

2002-09-11 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE