EP 1238412 A1 20020911 - A VERTICALLY CONFIGURED CHAMBER USED FOR MULTIPLE PROCESSES
Title (en)
A VERTICALLY CONFIGURED CHAMBER USED FOR MULTIPLE PROCESSES
Title (de)
VERTIKALE KONFIGURIERTE KAMMER FÜR VIELFACHVERFAHREN
Title (fr)
CHAMBRE DE CONFIGURATION VERTICALE UTILISEE POUR DIVERS PROCEDES
Publication
Application
Priority
- US 0034377 W 20001215
- US 46601499 A 19991217
Abstract (en)
[origin: WO0145144A1] The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electrochemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, cost and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
IPC 1-7
IPC 8 full level
C25D 7/12 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/3063 (2006.01)
CPC (source: EP KR US)
C25D 7/12 (2013.01 - EP KR US); C25D 17/001 (2013.01 - EP KR US); C25D 21/08 (2013.01 - KR); H01L 21/67028 (2013.01 - EP KR US); H01L 21/6719 (2013.01 - EP KR US); C25D 5/028 (2013.01 - KR); C25D 5/08 (2013.01 - KR); C25D 17/004 (2013.01 - KR); C25D 17/008 (2013.01 - KR); Y10S 134/902 (2013.01 - EP KR US)
Citation (search report)
See references of WO 0145144A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0145144 A1 20010621; AU 2437701 A 20010625; CN 1269182 C 20060809; CN 1423830 A 20030611; EP 1238412 A1 20020911; JP 2003517201 A 20030520; KR 20020073347 A 20020923; TW 501165 B 20020901; US 2002056646 A1 20020516; US 2002121435 A1 20020905; US 6352623 B1 20020305; US 6884334 B2 20050426; US 6969456 B2 20051129
DOCDB simple family (application)
US 0034377 W 20001215; AU 2437701 A 20001215; CN 00818435 A 20001215; EP 00988135 A 20001215; JP 2001545347 A 20001215; KR 20027007653 A 20020614; TW 89127026 A 20010117; US 4102901 A 20011228; US 4105801 A 20011228; US 4105802 A 20020107; US 46601499 A 19991217