EP 1239054 A1 20020911 - Heat treatment of hypereutectic Al-Si alloys
Title (en)
Heat treatment of hypereutectic Al-Si alloys
Title (de)
Wärmebehandlung von übereutektischen Al-Si-Legierungen
Title (fr)
Traitement thermique d'alliages Al-Si hypereutectiques
Publication
Application
Priority
DE 10110756 A 20010307
Abstract (en)
Heat treatment for casting of hypereutectic aluminum - silicon alloy applies a local heat at critical points (A-C) where there will be a high concentration of mechanical forces when in use. Heat is applied temporarily to heat metal to the melting point of primary silicon crystals and quenched. Molten zone is at a maximum depth of 1 mm, held at the melting temperature for a maximum of 3 secs. under a protective gas, using a cold welding process.
Abstract (de)
Ein Gussteil aus einer übereutektischen AI-Si-Legierung wird in einem lokalen Bereich hoher mechanischer Betriebsspannungskonzentration kurzzeitig bis in den schmelzflüssigen Bereich der primären Si-Kristalle erwärmt und dann abgeschreckt. <IMAGE>
IPC 1-7
IPC 8 full level
C22F 1/043 (2006.01)
CPC (source: EP)
C22F 1/043 (2013.01)
Citation (search report)
- [X] US 4711823 A 19871208 - SHIINA HARUO [JP]
- [X] US 4483286 A 19841120 - HERRMANN RUEDIGER [DE], et al
- [A] EP 0645465 A1 19950329 - KOBE STEEL LTD [JP]
- [A] US 5749980 A 19980512 - IZUCHI SHUHEI [JP], et al
- [A] US 5851320 A 19981222 - AURAN LARS [NO], et al
- [A] US 5143557 A 19920901 - PIERANTONI MICHEL [CH], et al
- [X] DATABASE CA [online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; MOIR, S. A. ET AL: "The effect of temperature gradient and growth rate on spacing between primary silicon particles in rapidly solidified hypereutectic aluminum-silicon alloys", XP002198446, retrieved from STN Database accession no. 115:164286
- [A] PATENT ABSTRACTS OF JAPAN vol. 015, no. 332 (C - 0861) 23 August 1991 (1991-08-23)
- [A] PATENT ABSTRACTS OF JAPAN vol. 008, no. 187 (C - 240) 28 August 1984 (1984-08-28) & J. CRYST. GROWTH (1991), 113(1-2), 77-82
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
DOCDB simple family (application)
EP 02002600 A 20020205; DE 10110756 A 20010307