EP 1241527 A1 20020918 - POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
Title (en)
POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
Title (de)
POSITIV ARBEITENDE PHOTOEMPFINDLICHE POLYIMIDHARZ-ZUSAMMENSETZUNG
Title (fr)
COMPOSITION DE RESINE DE POLYIMIDE PHOTOSENSIBLE DE TYPE POSITIF
Publication
Application
Priority
- JP 0008296 W 20001124
- JP 33951899 A 19991130
Abstract (en)
A positive type photosensitive resin composition which can be developed by an aqueous alkaline solution and which is excellent in the developability and the adhesion to a substrate, is presented. Namely, the present invention presents a positive type photosensitive polyimide resin composition characterized by comprising 100 parts by weight of a solvent-soluble polyimide having repeating units represented by the formula (1) and from 1 to 50 parts by weight of a polyimide precursor having repeating units represented by the formula (2), and by further containing an o-quinonediazide compound in an amount of from 1 to 100 parts by weight per 100 parts by weight of the total amount of the repeating units represented by the formula (1) and the repeating units represented by the formula (2): <CHEM> <CHEM> (wherein R<1> and R<3> are bivalent organic groups, from 1 to 90 mol% of R<1> is a bivalent organic group having one or plural groups of at least one type selected from the group consisting of a phenolic hydroxyl group, a carboxyl group, a thiophenol group and a sulfonic group, and from 10 to 99 mol% is a bivalent organic group having no phenolic hydroxyl, carboxylic, thiophenol or sulfonic group, and R<2> and R<4> are tetravalent organic groups constituting a tetracarboxylic acid or its derivative).
IPC 1-7
IPC 8 full level
C08K 5/20 (2006.01); C08K 5/28 (2006.01); C08L 79/08 (2006.01); G03F 7/023 (2006.01); H01L 21/312 (2006.01)
CPC (source: EP KR US)
C08K 5/20 (2013.01 - EP US); C08K 5/28 (2013.01 - EP US); C08L 79/08 (2013.01 - EP US); G03F 7/023 (2013.01 - KR); G03F 7/0233 (2013.01 - EP US); H01L 21/02118 (2013.01 - EP US); H01L 21/312 (2016.02 - US)
Designated contracting state (EPC)
DE FR GB NL
DOCDB simple family (publication)
EP 1241527 A1 20020918; EP 1241527 A4 20030115; CN 1208683 C 20050629; CN 1402841 A 20030312; KR 100732895 B1 20070627; KR 20030009327 A 20030129; TW I254833 B 20060511; US 6677099 B1 20040113; WO 0140873 A1 20010607
DOCDB simple family (application)
EP 00977917 A 20001124; CN 00816394 A 20001124; JP 0008296 W 20001124; KR 20027006881 A 20001124; TW 89125248 A 20001128; US 14839602 A 20020530