EP 1243022 A2 20020925 - THIN-FILM RESISTOR WITH HIGH TEMPERATURE COEFFICIENT FOR USE AS PASSIVE SEMICONDUCTOR COMPONENT FOR INTEGRATED CIRCUITS, AND METHOD FOR PRODUCING THE SAME
Title (en)
THIN-FILM RESISTOR WITH HIGH TEMPERATURE COEFFICIENT FOR USE AS PASSIVE SEMICONDUCTOR COMPONENT FOR INTEGRATED CIRCUITS, AND METHOD FOR PRODUCING THE SAME
Title (de)
DÜNNSCHICHTWIDERSTAND MIT HOHEM TEMPERATURKOEFFIZIENTEN ALS PASSIVES HALBLEITERBAUELEMENT FÜR INTEGRIERTE SCHALTUNGEN UND HERSTELLUNGSVERFAHREN
Title (fr)
RESISTANCE A COUCHE MINCE A COEFFICIENT DE TEMPERATURE ELEVE EN TANT QUE COMPOSANT PASSIF A SEMI-CONDUCTEUR POUR DES CIRCUITS INTEGRES ET PROCEDE DE FABRICATION DE LADITE RESISTANCE
Publication
Application
Priority
- DE 0004320 W 20001205
- DE 19961180 A 19991218
Abstract (en)
[origin: WO0145151A2] The invention relates to a semiconductor component with a WSiN layer as the thin-film resistor with high temperature coefficient for use as thermistor in bolometers. The production method comprises the thermal decoupling by means of thermistors that are self-contained or disposed on an insulation layer.
IPC 1-7
IPC 8 full level
G01J 5/20 (2006.01); H01L 21/02 (2006.01)
CPC (source: EP US)
G01J 5/20 (2013.01 - EP US); H01L 28/24 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0145151 A2 20010621; WO 0145151 A3 20020214; DE 19961180 A1 20010628; DE 19961180 C2 20020228; EP 1243022 A2 20020925; US 2002192853 A1 20021219; US 6884690 B2 20050426
DOCDB simple family (application)
DE 0004320 W 20001205; DE 19961180 A 19991218; EP 00993458 A 20001205; US 16818402 A 20020618