Global Patent Index - EP 1243025 A2

EP 1243025 A2 2002-09-25 - SEMICONDUCTOR PACKAGING

Title (en)

SEMICONDUCTOR PACKAGING

Title (de)

HALBLEITERGEHÄUSUNG

Title (fr)

ENCAPSULATION DE SEMI-CONDUCTEURS

Publication

EP 1243025 A2 (EN)

Application

EP 00967264 A

Priority

  • US 0027206 W
  • US 15673999 P

Abstract (en)

[origin: WO0124259A2] An electronic component and a method for making an electronic component are disclosed. The electronic component has a silicon package. The silicon package has a recess formed thereon in which a conductive region is placed. A bare die electronic device is disposed in the recess. The device has a top, a bottom, sides and a plurality of terminals, including a non-top terminal. The non-top terminal is electrically coupled to the conductive region. The electronic component is constructed by first creating a recess in a silicon wafer to a depth substantially equal to the first dimension of the bare die electronic device. A conductive material is applied to the recess. The electronic device is inserted into the recess so that the bottom terminal is coupled to the conductive material. A dielectric or other planarizing material is applied into the recess. Top and bottom contacts are then applied to form the electronic component so that it may be used as a ball grid array package. The top contact is electrically coupled to the top terminal of the electronic device and the bottom contact is coupled electrically to the conductive material.

IPC 1-7 (main, further and additional classification)

H01L 23/13

IPC 8 full level (invention and additional information)

H01L 21/60 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)

CPC (invention and additional information)

H01L 24/97 (2013.01); H01L 23/13 (2013.01); H01L 23/147 (2013.01); H01L 23/3121 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15157 (2013.01); H01L 2924/15165 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/3025 (2013.01)

Combination set (CPC)

  1. H01L 2924/15165 + H01L 2924/15153
  2. H01L 2224/24227 + H01L 2924/15165
  3. H01L 2224/97 + H01L 2224/82
  4. H01L 2224/97 + H01L 2924/15311
  5. H01L 2224/2919 + H01L 2924/0665 + H01L 2924/00
  6. H01L 2924/0665 + H01L 2924/00
  7. H01L 2924/12036 + H01L 2924/00

Citation (search report)

See references of WO 0124259A3

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 0124259 A2 20010405; WO 0124259 A3 20011129; AU 7748800 A 20010430; EP 1243025 A2 20020925

INPADOC legal status


2010-09-22 [18R] REFUSED

- Effective date: 20100413

2003-09-17 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: SKYWORKS SOLUTIONS, INC.

2003-07-30 [RAP1] TRANSFER OF RIGHTS OF AN APPLICATION

- Owner name: SKYWORKS SOLUTIONS, INC.

2002-09-25 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20020411

2002-09-25 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

2002-09-25 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO:

- Free text: AL;LT;LV;MK;RO;SI