EP 1246305 A2 20021002 - An electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
Title (en)
An electric contact and an electric connector both using resin solder and a method of connecting them to a printed circuit board
Title (de)
Elektrisches Kontaktelement und elektrischer Verbinder, beide unter Verwendung von Härz-Lötpaste, und Verfahren zum Verbinden mit einer Leiterplatte
Title (fr)
Contact électrique et connecteur électrique utilisant tous deux une pâte à souder à base de résine, et méthode de connexion sur une plaque à circuit imprimés
Publication
Application
Priority
JP 2001102649 A 20010330
Abstract (en)
The objectives of the present invention include to mount an electric contact or an electric connector on a printed circuit board without conducting the soldering work, and to make mounting the electric contact on a printed circuit board by an automatic machine even when the electric contact is microminiaturized. <??>The electric contact (100) using resin solder according to the present invention is connected to a printed circuit board (400), which has a conductor (410) being provided on a surface thereof. This electric contact (100) comprises a leg (110), which contacts the conductor (410) of the printed circuit board (400), and a connecting part (120), which is connected to the conductor of the counterpart member. At least a part of the leg (110), which contacts the conductor (410) of the printed circuit board (400), is made of a lead-free ultrahigh-conductive plastic being a conductive resin composite. The electric connector (C) comprises the electric contact (100) and an insulating housing (300), which holds the electric contact (100) so that the part of the leg (110), which contacts the conductor (410) of the printed circuit board (400), is exposed. <IMAGE>
IPC 1-7
H01R 12/04; H01R 4/58; H01R 13/646; H01R 13/03; H05K 13/04; H01R 43/02
IPC 8 full level
C08K 3/08 (2006.01); C08K 7/06 (2006.01); C08L 101/12 (2006.01); H01R 4/02 (2006.01); H01R 4/68 (2006.01); H01R 12/57 (2011.01); H01R 13/03 (2006.01); H01R 13/46 (2006.01); H01R 24/50 (2011.01); H01R 43/24 (2006.01); H05K 1/03 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01)
CPC (source: EP KR US)
H01R 4/68 (2013.01 - KR); H01R 12/57 (2013.01 - EP US); H01R 13/03 (2013.01 - EP US); H01R 24/50 (2013.01 - EP US); H05K 3/3426 (2013.01 - EP US); H05K 3/3442 (2013.01 - EP US); H05K 13/0465 (2013.01 - EP US); H01R 4/02 (2013.01 - EP US); H01R 2103/00 (2013.01 - EP US); H05K 2201/0129 (2013.01 - EP US); H05K 2201/0215 (2013.01 - EP US); H05K 2201/10909 (2013.01 - EP US); H05K 2203/0425 (2013.01 - EP US); H05K 2203/065 (2013.01 - EP US); H05K 2203/1115 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1246305 A2 20021002; EP 1246305 A3 20031126; CN 1379503 A 20021113; HK 1049922 A1 20030530; JP 2002298940 A 20021011; KR 20020077270 A 20021011; TW 554596 B 20030921; US 2002139574 A1 20021003; US 6717065 B2 20040406
DOCDB simple family (application)
EP 02007088 A 20020327; CN 02108507 A 20020328; HK 03102089 A 20030321; JP 2001102649 A 20010330; KR 20020017485 A 20020329; TW 91104417 A 20020308; US 11477502 A 20020401