EP 1247291 A1 20021009 - DEVICE FOR TREATING SUBSTRATES
Title (en)
DEVICE FOR TREATING SUBSTRATES
Title (de)
VORRICHTUNG ZUM BEHANDELN VON SUBSTRATEN
Title (fr)
DISPOSITIF POUR TRAITER DES SUBSTRATS
Publication
Application
Priority
- DE 19962169 A 19991222
- EP 0012145 W 20001202
Abstract (en)
[origin: WO0146995A1] The aim of the invention is to provide a simple and economical device for opening and closing separate suction openings (13, 14, 15) of a device (1) which is provided for treating substrates, especially semiconductor wafers, and which comprises a treatment reservoir (3). Said treatment reservoir is filled with a treatment fluid and is arranged in an essentially closed space that has at least two separate suction openings (13, 14, 15). To this end, a rotatable disc (17) is provided which covers up the suction opening while isolating it from the space and which comprises a through-opening (18). One of the suction openings (13, 14, 15) can be at least partially overlapped by said through-opening.
IPC 1-7
IPC 8 full level
H01L 21/304 (2006.01); F16K 3/08 (2006.01); H01L 21/683 (2006.01)
CPC (source: EP KR US)
F16K 3/085 (2013.01 - EP US); H01L 21/00 (2013.01 - KR); H01L 21/6838 (2013.01 - EP US)
Citation (search report)
See references of WO 0146995A1
Designated contracting state (EPC)
AT BE CH DE FR IT LI
DOCDB simple family (publication)
WO 0146995 A1 20010628; DE 19962169 A1 20010712; DE 19962169 C2 20020523; EP 1247291 A1 20021009; JP 2003524297 A 20030812; KR 20020063252 A 20020801; TW 539573 B 20030701; US 2003029480 A1 20030213
DOCDB simple family (application)
EP 0012145 W 20001202; DE 19962169 A 19991222; EP 00983207 A 20001202; JP 2001547631 A 20001202; KR 20027008041 A 20020621; TW 89127352 A 20001220; US 16906002 A 20020822