EP 1248685 B1 20040908 - METHOD FOR PRODUCING A MICROSTRUCTURED SURFACE RELIEF BY EMBOSSING THIXOTROPIC LAYERS AND MICROSTRUCTURED SURFACE RELIEF
Title (en)
METHOD FOR PRODUCING A MICROSTRUCTURED SURFACE RELIEF BY EMBOSSING THIXOTROPIC LAYERS AND MICROSTRUCTURED SURFACE RELIEF
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES MIKROSTRUKTURIERTEN OBERFLÄCHENRELIEFS DURCH PRÄGEN THIXOTROPER SCHICHTEN UND MIKROSTRUKTURIERTES OBERFLÄCHENRELIEF
Title (fr)
PROCEDE DE PRODUCTION D'UN RELIEF SUPERFICIEL MICROSTRUCTURE PAR ESTAMPAGE DE COUCHES THIXOTROPES ET RELIEF SUPERFICIEL MICROSTRUCTURE
Publication
Application
Priority
- DE 10001135 A 20000113
- EP 0100333 W 20010112
Abstract (en)
[origin: WO0151220A2] The invention relates to a method for producing a microstructured surface relief by applying a coating composition to a substrate. Said coating composition is thixotropic or acquires thixotropic properties on the substrate when pretreated. According to the invention, an embossing device is used to emboss the surface relief into the applied thixotropic coating composition, and the coating composition hardens after removing the embossing device. The substrates which are obtained by using this method and which are provided with a microstructured surface relief are particularly suited for optical, electronic, micromechanical and/or antisoiling applications.
IPC 1-7
IPC 8 full level
B05D 5/06 (2006.01); B05D 1/00 (2006.01); B05D 1/42 (2006.01); B05D 3/12 (2006.01); B05D 7/24 (2006.01)
CPC (source: EP KR US)
B05D 1/42 (2013.01 - EP KR US); B05D 3/12 (2013.01 - EP KR US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0151220 A2 20010719; WO 0151220 A3 20020221; AT E275441 T1 20040915; AU 4050601 A 20010724; CN 1176756 C 20041124; CN 1395512 A 20030205; DE 10001135 A1 20010719; DE 50103534 D1 20041014; EP 1248685 A2 20021016; EP 1248685 B1 20040908; JP 2003527231 A 20030916; JP 5279159 B2 20130904; KR 100737554 B1 20070710; KR 20020092357 A 20021211; US 2004026832 A1 20040212; US 6855371 B2 20050215
DOCDB simple family (application)
EP 0100333 W 20010112; AT 01911478 T 20010112; AU 4050601 A 20010112; CN 01803635 A 20010112; DE 10001135 A 20000113; DE 50103534 T 20010112; EP 01911478 A 20010112; JP 2001551628 A 20010112; KR 20027008966 A 20020711; US 16997102 A 20020710