EP 1249863 A8 20030115 - SEMICONDUCTOR JOINING SUBSTRATE-USE TAPE WITH ADHESIVE AND COPPER-CLAD LAMINATE SHEET USING IT
Title (en)
SEMICONDUCTOR JOINING SUBSTRATE-USE TAPE WITH ADHESIVE AND COPPER-CLAD LAMINATE SHEET USING IT
Title (de)
SELBSTKLEBEBAND FÜR SUBSTRATE ZUR VERBINDUNG MIT HALBLEITERN UND KUPFERKASCHIERTES LAMINAT MIT DIESEM KLEBEBAND
Title (fr)
BANDE ADHESIVE DESTINEE A ETRE UTILISEE POUR UN SUBSTRAT DE CONNEXION DE SEMI-CONDUCTEURS ET FEUILLE STRATIFIEE REVETUE DE CUIVRE UTILISANT LADITE BANDE
Publication
Application
Priority
- JP 0107183 W 20010822
- JP 2000255352 A 20000825
Abstract (en)
[origin: EP1249863A1] Semiconductor-use tape with an adhesive comprises a laminate consisting of an insulating film layer having a linear expansion coefficient in a film width direction (TD) at 50-200[deg]C of 17-30 ppm/[deg]C and tensile modulus of elasticity of 6-12 Gpa, and at least one semi-cured adhesive layer. .
IPC 1-7
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01)
CPC (source: EP KR US)
H01L 21/60 (2021.08 - KR); H01L 23/3114 (2013.01 - EP US); H01L 23/3128 (2013.01 - EP US); H01L 23/3185 (2013.01 - EP US); H01L 23/49572 (2013.01 - EP US); H01L 24/50 (2013.01 - EP US); H01L 24/86 (2013.01 - EP US); H01L 2224/16 (2013.01 - EP US); H01L 2224/16245 (2013.01 - EP US); H01L 2224/45144 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01019 (2013.01 - EP US); H01L 2924/01023 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01045 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/01077 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/01082 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/12042 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/15311 (2013.01 - EP US); H01L 2924/351 (2013.01 - EP US); Y10T 428/24843 (2015.01 - EP US); Y10T 428/28 (2015.01 - EP US); Y10T 428/2852 (2015.01 - EP US); Y10T 428/287 (2015.01 - EP US)
C-Set (source: EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
EP 1249863 A1 20021016; EP 1249863 A4 20050316; EP 1249863 A8 20030115; EP 1249863 B1 20071205; AT E380393 T1 20071215; CN 1204611 C 20050601; CN 1393033 A 20030122; DE 60131725 D1 20080117; DE 60131725 T2 20081106; HK 1051441 A1 20030801; JP 2002076062 A 20020315; JP 4665298 B2 20110406; KR 100602537 B1 20060720; KR 20020044569 A 20020615; TW 594891 B 20040621; US 2003031867 A1 20030213; US 6982484 B2 20060103; WO 0217379 A1 20020228
DOCDB simple family (application)
EP 01958398 A 20010822; AT 01958398 T 20010822; CN 01803144 A 20010822; DE 60131725 T 20010822; HK 03103570 A 20030520; JP 0107183 W 20010822; JP 2000255352 A 20000825; KR 20027005242 A 20020424; TW 90120598 A 20010822; US 11130202 A 20020423