EP 1250710 A1 20021023 - DEVICE FOR THERMAL TREATMENT OF SUBSTRATES
Title (en)
DEVICE FOR THERMAL TREATMENT OF SUBSTRATES
Title (de)
VORRICHTUNG ZUM THERMISCHEN BEHANDELN VON SUBSTRATEN
Title (fr)
DISPOSITIF DE TRAITEMENT THERMIQUE DE SUBSTRATS
Publication
Application
Priority
- DE 10003639 A 20000128
- EP 0100607 W 20010119
Abstract (en)
[origin: WO0156064A1] The aim of the invention is to reduce the formation of scratches in a device for the thermal treatment of substrates, in particular, semiconductor substrates, in a chamber in which the substrate is placed upon support elements. According to the invention, said aim is achieved by means of displaceable support elements.
IPC 1-7
IPC 8 full level
H01L 21/00 (2006.01); H01L 21/324 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC (source: EP KR US)
H01L 21/324 (2013.01 - KR); H01L 21/67115 (2013.01 - EP US); H01L 21/68742 (2013.01 - EP US); H01L 21/6875 (2013.01 - EP US); H01L 21/68785 (2013.01 - EP US)
Citation (search report)
See references of WO 0156064A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0156064 A1 20010802; DE 10003639 A1 20010809; DE 10003639 C2 20030618; EP 1250710 A1 20021023; JP 2003525524 A 20030826; JP 4828761 B2 20111130; KR 100744215 B1 20070730; KR 20020071971 A 20020913; TW 488009 B 20020521; US 2004029065 A1 20040212; US 6953338 B2 20051011
DOCDB simple family (application)
EP 0100607 W 20010119; DE 10003639 A 20000128; EP 01901179 A 20010119; JP 2001555121 A 20010119; KR 20027009638 A 20020726; TW 90101432 A 20010129; US 18259403 A 20030728