EP 1250712 A2 20021023 - PROCESS AND APPARATUS FOR CLEANING SILICON WAFERS
Title (en)
PROCESS AND APPARATUS FOR CLEANING SILICON WAFERS
Title (de)
VERFAHREN UND EINRICHTUNG ZUR REINIGUNG VON SILIZIUM SUBSTRATEN
Title (fr)
PROCEDE ET DISPOSITIF DE NETTOYAGE DE TRANCHES DE SILICIUM
Publication
Application
Priority
- US 0102119 W 20010119
- US 49016200 A 20000122
Abstract (en)
[origin: WO0154181A2] An effective electropurge process and apparatus for wet processing of semiconductor wafers applies electrical charges to the wafer surface with an ample voltage sufficient to provide an effective field intensity which can substantially eliminate intolerable sub-0.05 micron "killer" defects when making highly advanced microchips with a feature size or line width less than 0.15 micron. The process can be used with frequent voltage reversal for automated wet-batch cleaning operations using cassettes that hold 10 to 50 wafers at a time and in various other operations involving megasonic transducers, mechanical brush scrubbers, laser cleaners and CMP equipment. The electropurge process is primarily intended for Fab plants where large wafers with a diameter of 200 to 400 mm require 250 to 350 steps including many dry layering, patterning and doping operations and at least 30 wet processing steps.
IPC 1-7
IPC 8 full level
H01L 21/304 (2006.01); B08B 3/10 (2006.01); C23G 1/02 (2006.01); C23G 1/14 (2006.01); C25F 1/00 (2006.01); H01L 21/00 (2006.01); H01L 21/306 (2006.01)
CPC (source: EP)
B08B 3/10 (2013.01); C23G 1/02 (2013.01); C23G 1/14 (2013.01); C25F 1/00 (2013.01); H01L 21/02052 (2013.01); H01L 21/6704 (2013.01); H01L 21/67057 (2013.01); H01L 21/67051 (2013.01)
Citation (search report)
See references of WO 0154181A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0154181 A2 20010726; WO 0154181 A3 20020103; AU 3291401 A 20010731; EP 1250712 A2 20021023; JP 2003522406 A 20030722
DOCDB simple family (application)
US 0102119 W 20010119; AU 3291401 A 20010119; EP 01904990 A 20010119; JP 2001553573 A 20010119