Global Patent Index - EP 1252655 A1

EP 1252655 A1 20021030 - MICROWAVE IC PACKAGE WITH DUAL MODE WAVE GUIDE

Title (en)

MICROWAVE IC PACKAGE WITH DUAL MODE WAVE GUIDE

Title (de)

MIKROWELLEN-IS-GEHÄUSE MIT DUAL-MODUS WELLENLEITER

Title (fr)

BOITIER HYPERFREQUENCE A MICROCIRCUIT INTEGRE POURVU D'UN GUIDE D'ONDES BIMODE

Publication

EP 1252655 A1 20021030 (EN)

Application

EP 01902069 A 20010112

Priority

  • US 0101276 W 20010112
  • US 17584300 P 20000113

Abstract (en)

[origin: WO0152325A1] A surface mount package for a microwave circuit is disclosed. The package has a port for transferring a signal from the microwave circuit to a printed circuit board. The package includes a base made from a dielectric material which includes vias which contain a conductive material and are electrically coupled to the ground potential of the printed circuit board. Conductive material is placed on the topside of the base forming a transmission line for carrying the signal in a transmission line mode. To facilitate operation in a transmission line mode, the length of the transmission line is a substantial portion of the wavelength of the signal. The transmission line provides electrical contact with a terminal of the microwave circuit and is electrically coupled to the port. Additionally, the transmission line forms an electromagnetic wave guiding structure. In one embodiment, the electromagnetic wave guiding structure operates in both grounded coplanar waveguide and microstrip mode where a second conductive material resides on the top side of the base and spaced a distance from the first conductive material. In such a configuration, a portion of the base separates the first and second conductive materials, and the second conductive material substantially surrounds the first conductive material of the transmission line.

IPC 1-7

H01L 23/66; H01L 23/498

IPC 8 full level

H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01)

CPC (source: EP US)

H01L 23/49805 (2013.01 - EP US); H01L 23/66 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 24/49 (2013.01 - EP US); H01L 24/81 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); H01L 24/85 (2013.01 - EP US); H01L 2223/6627 (2013.01 - EP US); H01L 2224/0401 (2013.01 - EP US); H01L 2224/05599 (2013.01 - EP US); H01L 2224/291 (2013.01 - EP US); H01L 2224/29111 (2013.01 - EP US); H01L 2224/29144 (2013.01 - EP US); H01L 2224/2929 (2013.01 - EP US); H01L 2224/29339 (2013.01 - EP US); H01L 2224/45014 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48195 (2013.01 - EP US); H01L 2224/4911 (2013.01 - EP US); H01L 2224/49175 (2013.01 - EP US); H01L 2224/81801 (2013.01 - EP US); H01L 2224/83801 (2013.01 - EP US); H01L 2224/83851 (2013.01 - EP US); H01L 2224/85 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01028 (2013.01 - EP US); H01L 2924/01046 (2013.01 - EP US); H01L 2924/01078 (2013.01 - EP US); H01L 2924/01079 (2013.01 - EP US); H01L 2924/09701 (2013.01 - EP US); H01L 2924/12036 (2013.01 - EP US); H01L 2924/14 (2013.01 - EP US); H01L 2924/1423 (2013.01 - EP US); H01L 2924/15173 (2013.01 - EP US); H01L 2924/15313 (2013.01 - EP US); H01L 2924/15787 (2013.01 - EP US); H01L 2924/1579 (2013.01 - EP US); H01L 2924/15798 (2013.01 - EP US); H01L 2924/16152 (2013.01 - EP US); H01L 2924/1903 (2013.01 - EP US); H01L 2924/3011 (2013.01 - EP US); H01L 2924/30111 (2013.01 - EP US); H05K 1/0243 (2013.01 - EP US); H05K 3/3442 (2013.01 - EP US)

C-Set (source: EP US)

  1. H01L 2924/15787 + H01L 2924/05432
  2. H01L 2224/291 + H01L 2924/01079 + H01L 2924/00014
  3. H01L 2924/1423 + H01L 2924/00
  4. H01L 2924/30111 + H01L 2924/00
  5. H01L 2924/12036 + H01L 2924/00
  6. H01L 2224/85399 + H01L 2924/00014
  7. H01L 2224/05599 + H01L 2924/00014
  8. H01L 2924/00014 + H01L 2224/45099
  9. H01L 2924/00014 + H01L 2224/45015 + H01L 2924/207
  10. H01L 2924/00014 + H01L 2224/45014 + H01L 2924/206
  11. H01L 2224/29144 + H01L 2924/0105
  12. H01L 2224/29144 + H01L 2924/01032
  13. H01L 2224/48091 + H01L 2924/00014
  14. H01L 2924/00014 + H01L 2224/05599
  15. H01L 2224/29339 + H01L 2924/00014
  16. H01L 2224/2929 + H01L 2924/0665 + H01L 2924/00014
  17. H01L 2224/29111 + H01L 2924/01079 + H01L 2924/00014
  18. H01L 2224/29111 + H01L 2924/01082 + H01L 2924/00014

Citation (search report)

See references of WO 0152325A1

Citation (examination)

US 5408053 A 19950418 - YOUNG BRIAN D [US]

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0152325 A1 20010719; AU 2791201 A 20010724; EP 1252655 A1 20021030; JP 2003520436 A 20030702; JP 4968871 B2 20120704; US 2001032740 A1 20011025; US 6617946 B2 20030909

DOCDB simple family (application)

US 0101276 W 20010112; AU 2791201 A 20010112; EP 01902069 A 20010112; JP 2001552446 A 20010112; US 76050201 A 20010112