EP 1254477 A2 20021106 - METHOD AND APPARATUS FOR PROCESSING A MICROELECTRONIC WORKPIECE AT AN ELEVATED TEMPERATURE
Title (en)
METHOD AND APPARATUS FOR PROCESSING A MICROELECTRONIC WORKPIECE AT AN ELEVATED TEMPERATURE
Title (de)
VERFAHREN UND VORRICHTUNG ZUR VERARBEITUNG EINES MIKROELEKTRONISCHEN WERKSTÜCKS BEI HOHEN TEMPERATUREN
Title (fr)
DISPOSITIF ET PROCEDE DE TRAITEMENT A TEMPERATURE ELEVEE D'UNE PIECE OUVREE DE MICRO-ELECTRONIQUE
Publication
Application
Priority
- US 0104444 W 20010208
- US 50100200 A 20000209
- US 73360800 A 20001208
Abstract (en)
[origin: WO0159815A2] An apparatus and method for processing a microelectronic workpiece at an elevated temperature. In one embodiment, the apparatus includes a workpiece support positioned to engage and support the microelectronic workpiece during operation. The apparatus can further include a heat source having a solid engaging surface positioned to engage a surface of the microelectronic workpiece with at least one of the heat source and the workpiece support being movable relative to the other between a first position with the microelectronic workpiece contacting the engaging surface of the heat source and a second position with the microelectronic workpiece spaced apart from the engaging surface. The heat source is sized to transfer heat to the microelectronic workpiece at a rate sufficient to thermally process a selected material of the microelectronic workpiece when the microelectronic workpiece is engaged with the heat source. A heat sink can be positioned at least proximate to the heat source to cool both the heat source and the microelectronic workpiece.
IPC 1-7
IPC 8 full level
H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01)
CPC (source: EP)
H01L 21/67103 (2013.01)
Citation (search report)
See references of WO 0159815A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0159815 A2 20010816; WO 0159815 A3 20020221; AU 3814901 A 20010820; EP 1254477 A2 20021106; JP 2003524299 A 20030812; TW 495885 B 20020721
DOCDB simple family (application)
US 0104444 W 20010208; AU 3814901 A 20010208; EP 01910554 A 20010208; JP 2001559043 A 20010208; TW 90102866 A 20010209