EP 1254479 A1 20021106 - WAFER BONDING TECHNIQUES TO MINIMIZE BUILT-IN STRESS OF SILICON MICROSTRUCTURES AND MICRO-MIRRORS
Title (en)
WAFER BONDING TECHNIQUES TO MINIMIZE BUILT-IN STRESS OF SILICON MICROSTRUCTURES AND MICRO-MIRRORS
Title (de)
TECHNIK ZUM ZUSAMMENFÜGEN VON SCHEIBEN UNTER MINIMIERUNG DES EINGEBAUTEN STRESSES VON SILIZIUM MIKROSTRUKTUREN UND MIKROSPIEGEL
Title (fr)
LIAGE DESTINE A MINIMISER LA CONTRAINTE INTEGREE DES MICROSTRUCTURES ET DES MICROMIROIRS EN SILICIUM
Publication
Application
Priority
- US 0101758 W 20010118
- US 17632500 P 20000118
- US 71591600 A 20001116
Abstract (en)
[origin: WO0154176A1] A bonded wafer fabrication mechanism for a micro-mirror structure provides for oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.
IPC 1-7
IPC 8 full level
H01L 21/20 (2006.01); H01L 21/762 (2006.01)
CPC (source: EP)
H01L 21/2007 (2013.01); H01L 21/76251 (2013.01)
Citation (search report)
See references of WO 0154176A1
Designated contracting state (EPC)
AT BE CH DE FR GB LI
DOCDB simple family (publication)
WO 0154176 A1 20010726; WO 0154176 A9 20030116; AU 3098201 A 20010731; CA 2397760 A1 20010726; EP 1254479 A1 20021106
DOCDB simple family (application)
US 0101758 W 20010118; AU 3098201 A 20010118; CA 2397760 A 20010118; EP 01903124 A 20010118