Global Patent Index - EP 1254484 A2

EP 1254484 A2 20021106 - PIEZOELECTRIC SUBSTRATE MATERIAL WITH AN INCREASED RESISTANCE TO BREAKING AND METHOD FOR PRODUCING THE SAME

Title (en)

PIEZOELECTRIC SUBSTRATE MATERIAL WITH AN INCREASED RESISTANCE TO BREAKING AND METHOD FOR PRODUCING THE SAME

Title (de)

PIEZOELEKTRISCHES SUBSTRATMATERIAL MIT ERHÖHTER BRUCHFESTIGKEIT UND HERSTELLUNGSVERFAHREN

Title (fr)

MATERIAU SUBSTRAT PIEZO-ELECTRIQUE DE RESISTANCE A LA RUPTURE AMELIOREE ET SON PROCEDE DE PRODUCTION

Publication

EP 1254484 A2 20021106 (DE)

Application

EP 01919125 A 20010202

Priority

  • DE 0100405 W 20010202
  • DE 10005596 A 20000209

Abstract (en)

[origin: WO0159853A2] The aim of the invention is to increase the resistance to breaking of components on piezoelectric substrates. To this end, an absorber layer which has high optical absorption, binds particles and seals cracks is provided on the rear side of the substrate.

[origin: WO0159853A2] The aim of the invention is to increase resistance to breaking and to prevent optical reflections during structuring for producing components on piezoelectric substrates. To this end, an absorber layer (2) which has high optical absorption, binds particles and seals cracks is provided on the rear side of the substrate (1). The absorber layer (2) is advantageously also electroconductive in order to be able to divert pyroelectric charges.

IPC 1-7

H01L 41/08; G03F 7/09; H03H 3/08

IPC 8 full level

H10N 30/20 (2023.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/25 (2006.01); H10N 30/01 (2023.01); H10N 30/07 (2023.01); H10N 30/80 (2023.01); H10N 30/85 (2023.01)

CPC (source: EP KR US)

H03H 3/08 (2013.01 - EP); H03H 9/02622 (2013.01 - EP); H10N 30/80 (2023.02 - EP KR); H10N 30/883 (2023.02 - US)

Designated contracting state (EPC)

AT BE CH CY DE FR GB LI

DOCDB simple family (publication)

WO 0159853 A2 20010816; WO 0159853 A3 20020221; CA 2399122 A1 20010816; DE 10005596 A1 20010816; EP 1254484 A2 20021106; JP 2003523117 A 20030729; KR 20020080411 A 20021023

DOCDB simple family (application)

DE 0100405 W 20010202; CA 2399122 A 20010202; DE 10005596 A 20000209; EP 01919125 A 20010202; JP 2001559073 A 20010202; KR 20027010226 A 20020808