Global Patent Index - EP 1256131 A1

EP 1256131 A1 20021113 - LEADFRAME INTERPOSER

Title (en)

LEADFRAME INTERPOSER

Title (de)

LEADFRAME INTERPOSER

Title (fr)

INTERPOSEUR DE GRILLE DE CONNEXION

Publication

EP 1256131 A1 20021113 (DE)

Application

EP 01913532 A 20010125

Priority

  • DE 0100283 W 20010125
  • DE 10006445 A 20000214

Abstract (en)

[origin: WO0159840A1] The invention relates to a leadframe interposer provided with an upset which is formed by an elevated section in a middle area, and the vertical dimensions of the interposer are enlarged there so that when assembling a housing stack consisting of a number of semiconductor chips, the elevated section presses against an upper side or lower side of a chip housing thereby exerting a compensating turning moment onto the interposer which prevents a possible twisting or deformation from occurring when applying the connecting conductors to the laterally offset contact regions of the interposer.

IPC 1-7

H01L 23/495; H01L 25/10

IPC 8 full level

H01L 23/495 (2006.01); H01L 25/10 (2006.01)

CPC (source: EP US)

H01L 23/495 (2013.01 - EP US); H01L 25/105 (2013.01 - EP US); H01L 2225/1029 (2013.01 - EP US); H01L 2225/107 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US)

Citation (search report)

See references of WO 0159840A1

Designated contracting state (EPC)

AT DE FR GB IT

DOCDB simple family (publication)

WO 0159840 A1 20010816; DE 10006445 A1 20010823; DE 10006445 C2 20020328; EP 1256131 A1 20021113; US 2003027437 A1 20030206; US 6652291 B2 20031125

DOCDB simple family (application)

DE 0100283 W 20010125; DE 10006445 A 20000214; EP 01913532 A 20010125; US 21870502 A 20020814