EP 1256263 A2 20021113 - METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
Title (en)
METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT
Title (de)
VERFAHREN UND GERÄT ZUR STROMVERSORGUNG EINES MIKROPROZESSORS MIT INTEGRIERTEN EMV- UND THERMOMANAGEMENT
Title (fr)
PROCEDE ET APPAREIL D'ALIMENTATION EN COURANT D'UN MICROPROCESSEUR A GESTION INTEGREE DE CHALEUR ET D'INTERFERENCE ELECTROMAGNETIQUE
Publication
Application
Priority
- US 0105067 W 20010216
- US 18347400 P 20000218
- US 18676900 P 20000303
- US 18777700 P 20000308
- US 19605900 P 20000410
- US 21981300 P 20000721
- US 23297100 P 20000914
Abstract (en)
[origin: WO0165344A2] A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
IPC 1-7
IPC 8 full level
G06F 1/18 (2006.01); H01L 23/32 (2006.01); H01L 23/427 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01); H05K 7/10 (2006.01); H05K 3/30 (2006.01)
CPC (source: EP KR)
G06F 1/18 (2013.01 - EP); G06F 1/182 (2013.01 - EP); G06F 1/189 (2013.01 - EP); H01L 23/427 (2013.01 - EP); H05K 1/00 (2013.01 - KR); H05K 1/141 (2013.01 - EP); H05K 7/1092 (2013.01 - EP); H01L 2224/16225 (2013.01 - EP); H01L 2224/32225 (2013.01 - EP); H01L 2224/32245 (2013.01 - EP); H01L 2224/73204 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H01L 2224/92125 (2013.01 - EP); H01L 2924/15192 (2013.01 - EP); H01L 2924/3011 (2013.01 - EP); H05K 1/0263 (2013.01 - EP); H05K 3/301 (2013.01 - EP); H05K 3/368 (2013.01 - EP); H05K 2201/10318 (2013.01 - EP); H05K 2201/10325 (2013.01 - EP); H05K 2201/10598 (2013.01 - EP); H05K 2201/10704 (2013.01 - EP); H05K 2201/10734 (2013.01 - EP); H05K 2201/2018 (2013.01 - EP)
Citation (search report)
See references of WO 0165344A2
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
DOCDB simple family (publication)
WO 0165344 A2 20010907; WO 0165344 A3 20020425; WO 0165344 B1 20020627; AU 6655101 A 20010912; CA 2400568 A1 20010907; CN 1419803 A 20030521; EP 1256263 A2 20021113; JP 2003529921 A 20031007; KR 100699094 B1 20070321; KR 20020092961 A 20021212; MX PA02008042 A 20040906
DOCDB simple family (application)
US 0105067 W 20010216; AU 6655101 A 20010216; CA 2400568 A 20010216; CN 01807247 A 20010216; EP 01944108 A 20010216; JP 2001563974 A 20010216; KR 20027010820 A 20020819; MX PA02008042 A 20010216