Global Patent Index - EP 1256263 A2

EP 1256263 A2 2002-11-13 - METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT

Title (en)

METHOD AND APPARATUS FOR PROVIDING POWER TO A MICROPROCESSOR WITH INTEGRATED THERMAL AND EMI MANAGEMENT

Title (de)

VERFAHREN UND GERÄT ZUR STROMVERSORGUNG EINES MIKROPROZESSORS MIT INTEGRIERTEN EMV- UND THERMOMANAGEMENT

Title (fr)

PROCEDE ET APPAREIL D'ALIMENTATION EN COURANT D'UN MICROPROCESSEUR A GESTION INTEGREE DE CHALEUR ET D'INTERFERENCE ELECTROMAGNETIQUE

Publication

EP 1256263 A2 (EN)

Application

EP 01944108 A

Priority

  • US 0105067 W
  • US 18347400 P
  • US 18676900 P
  • US 18777700 P
  • US 19605900 P
  • US 21981300 P
  • US 23297100 P

Abstract (en)

[origin: WO0165344A2] A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

IPC 1-7 (main, further and additional classification)

H05K 7/10

IPC 8 full level (invention and additional information)

H05K 3/34 (2006.01); G06F 1/18 (2006.01); H01L 23/32 (2006.01); H01L 23/427 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H05K 7/10 (2006.01); H05K 3/30 (2006.01)

CPC (invention and additional information)

H01L 23/427 (2013.01); G06F 1/18 (2013.01); G06F 1/182 (2013.01); G06F 1/189 (2013.01); H05K 1/141 (2013.01); H05K 7/1092 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0263 (2013.01); H05K 3/301 (2013.01); H05K 3/368 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10598 (2013.01); H05K 2201/10704 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/2018 (2013.01)

Combination set (CPC)

H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00

Citation (search report)

See references of WO 0165344A3

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

EPO simple patent family

WO 0165344 A2 20010907; WO 0165344 A3 20020425; WO 0165344 B1 20020627; AU 6655101 A 20010912; CA 2400568 A1 20010907; CN 1419803 A 20030521; EP 1256263 A2 20021113; JP 2003529921 A 20031007; MX PA02008042 A 20040906

INPADOC legal status


2012-05-30 [18D] APPLICATION DEEMED TO BE WITHDRAWN

- Effective date: 20111213

2008-09-10 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20080806

2003-04-09 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: DIBENE, JOSEPH, TED, II

2003-04-09 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: HARTKE, DAVID

2003-04-09 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: KASKADE, JAMES, HJERPE

2003-04-09 [RIN1] INVENTOR CHANGED BEFORE GRANT

- Inventor name: HOGE, CARL, E.

2002-11-13 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20020902

2002-11-13 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

2002-11-13 [AX] REQUEST FOR EXTENSION OF THE EUROPEAN PATENT TO:

- Free text: AL;LT;LV;MK;RO;SI