Global Patent Index - EP 1256403 A2

EP 1256403 A2 20021113 - Metal casting with hard material insert

Title (en)

Metal casting with hard material insert

Title (de)

Metallgussformkörper mit eingegossenem Hartstoffkörper

Title (fr)

Pièce moulée métallique avec d'insert en matériaux durs

Publication

EP 1256403 A2 20021113 (DE)

Application

EP 02009288 A 20020429

Priority

DE 10122886 A 20010511

Abstract (en)

Metal cast molded body comprises an active surface (2) made from a composite material. The composite material has a porous hard material body (7) in a cast matrix (4) made from metallic cast material. An Independent claim is also included for a process for the production of a metal cast molded body. Preferably the matrix is a wear-resistant iron-based alloy, preferably a wear-resistant cast iron. The hard material body is a ceramic body made from carbides, oxides and/or nitrides, preferably a carbide of Si, Cr, W, Mo, V, Nb, Ti, Zr, Ta or Hf in an amount of 20-70 wt.%. The cast matrix has a bainite and/or martensite structure.

Abstract (de)

Metallgussformkörper mit wenigstens einer von einem Verbundwerkstoff gebildeten Wirkfläche (2) für eine Bearbeitung oder Verarbeitung eines Materials, wobei der Verbundwerkstoff (3) in einer Gussmatrix (4) aus einem metallischen Gussmaterial wenigstens einen porösen Hartstoffkörper (7) aufweist, in den das Gussmaterial eingedrungen ist. <IMAGE>

IPC 1-7

B22D 19/00; C22C 1/10; C22C 33/00

IPC 8 full level

B22D 19/00 (2006.01); B02C 7/12 (2006.01); B02C 15/00 (2006.01); B22D 19/06 (2006.01); C22C 1/10 (2006.01); C22C 37/00 (2006.01)

CPC (source: EP US)

B02C 7/12 (2013.01 - EP US); B02C 15/003 (2013.01 - EP US); C22C 1/1021 (2023.01 - EP); C22C 1/1036 (2013.01 - EP US); B02C 2210/02 (2013.01 - EP US); C22C 1/1021 (2023.01 - US)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

EP 1256403 A2 20021113; EP 1256403 A3 20040915; CA 2383171 A1 20021111; CA 2383171 C 20070626; DE 10164975 B4 20090820; JP 2003048049 A 20030218; JP 4275900 B2 20090610; US 2002195223 A1 20021226; US 2005016708 A1 20050127; US 7198209 B2 20070403; ZA 200203733 B 20021223

DOCDB simple family (application)

EP 02009288 A 20020429; CA 2383171 A 20020423; DE 10164975 A 20010511; JP 2002137840 A 20020513; US 14310502 A 20020510; US 92080004 A 20040818; ZA 200203733 A 20020510