Title (en)

VACUUM-TIGHT HOUSING FOR MOUNTING AT LEAST BIPOLAR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

VAKUUMDICHTES GEHÄUSE ZUM EINBAU VON MINDESTENS ZWEIPOLIGEN BAUELEMENTEN SOWIE VERFAHREN ZU DESSEN HERSTELLUNG

Title (fr)

BOITIER ETANCHE AU VIDE POUR LE MONTAGE DE COMPOSANTS AU MOINS BIPOLAIRES ET PROCEDE DE FABRICATION DUDIT BOITIER

Publication

EP 1257779 A1 20021120 (DE)

Application

EP 01905483 A 20010223

Priority

• AT 0100048 W 20010223
• AT 2802000 A 20000223

Abstract (en)

[origin: WO0163200A1] A vacuum-tight housing (100) for mounting at least bipolar components (111, 113, 215), comprising at least one two-layered bottom (101) which is composed of a metallic base body (102) and an insulating layer (103). A peripheral metallization coating (106) and a first contact field (105) which is electroconductively linked to the peripheral metallization coating (106), in addition to a second contact field (105') which is electroconductively linked to the metal base body (102) of the bottom of the housing (101) are arranged on said insulating layer (103) at the bottom of the housing (101). A first connection pin (109) is fixed to the metal base body (102) of the bottom of the housing. A housing cap (107) is joined to the peripheral metallization coating (106) of the bottom of the housing in a soldered or welded connection. A second connection pin is fixed to the outher casing thereof.

IPC 1-7

F42B 3/13; F42C 19/12

IPC 8 full level

F42B 3/13 (2006.01); F42C 19/12 (2006.01)

CPC (source: EP)

F42B 3/13 (2013.01); F42C 19/12 (2013.01)

Citation (search report)

See references of WO 0163200A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

DOCDB simple family (publication)

WO 0163200 A1 20010830; AT 408403 B 20011126; AT A2802000 A 20010315; AU 3348201 A 20010903; EP 1257779 A1 20021120

DOCDB simple family (application)

AT 0100048 W 20010223; AT 2802000 A 20000223; AU 3348201 A 20010223; EP 01905483 A 20010223